3M 3M Scotch-Weld DP812 Yellow Base & Accelerator (B/A) Potting & Encapsulating Compound - 1.6 fl oz Dual Cartridge - 31641 62329214357

Description
3M Scotch-Weld DP812 yellow potting & encapsulating compound is compatible with ceramic, metal, plastic and wood materials with a 24 hr cure time. Provides a 9 to 11 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 3500 psi.
Description
3M Scotch-Weld DP812 yellow potting & encapsulating compound is compatible with ceramic, metal, plastic and wood materials with a 24 hr cure time. Provides a 9 to 11 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 3500 psi.

Suppliers

Company
Product
Description
Supplier Links
3M Scotch-Weld DP812 Yellow Base & Accelerator (B/A) Potting & Encapsulating Compound - 1.6 fl oz Dual Cartridge - 31641 - 051115-31641 - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
3M Scotch-Weld DP812 Yellow Base & Accelerator (B/A) Potting & Encapsulating Compound - 1.6 fl oz Dual Cartridge - 31641
051115-31641
3M Scotch-Weld DP812 Yellow Base & Accelerator (B/A) Potting & Encapsulating Compound - 1.6 fl oz Dual Cartridge - 31641 051115-31641
3M Scotch-Weld DP812 yellow potting & encapsulating compound is compatible with ceramic, metal, plastic and wood materials with a 24 hr cure time. Provides a 9 to 11 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 3500 psi.

3M Scotch-Weld DP812 yellow potting & encapsulating compound is compatible with ceramic, metal, plastic and wood materials with a 24 hr cure time. Provides a 9 to 11 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 3500 psi.

Buy Now

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Encapsulants and Potting Compounds
Product Number 051115-31641
Product Name 3M Scotch-Weld DP812 Yellow Base & Accelerator (B/A) Potting & Encapsulating Compound - 1.6 fl oz Dual Cartridge - 31641
Unlock Full Specs
to access all available technical data

Similar Products

Formulations - Applications - Bonding - Tuffbond 302 - 3302AB22 - Hernon Manufacturing, Inc.
Specs
Form / Function 50 ml (two component)
Chemical System Ceramic; Epoxy
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity - Supreme 121AO - Master Bond, Inc.
Specs
Type High Dielectric; Optical; Thermally Conductive
Form / Function Gap Filler, Foam in Place Gasket; Liquid
Cure / Technology Thermoset; Two Component  
View Details
Conathane® - EN-2523 - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Form / Function Liquid
Cure / Technology Thermoset; Room Temperature Vulcanizing or Curing
Chemical System Polyurethane
View Details
Light-Curable Materials, Encapsulating, 9001-E-V3.1 -  - Dymax
Specs
Cure / Technology UV or Radiation Cured
Viscosity 4500 cP
View Details