3M 3M Scotch-Weld DP805 Off-White Base (Part B) Potting & Encapsulating Compound - 5 gal - 87233 62328885306

Description
3M Scotch-Weld DP805 off-white potting & encapsulating compound is compatible with ceramic, metal, plastic and wood materials with a 24 hr cure time. Provides a 3 to 4 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 3500 psi.
Description
3M Scotch-Weld DP805 off-white potting & encapsulating compound is compatible with ceramic, metal, plastic and wood materials with a 24 hr cure time. Provides a 3 to 4 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 3500 psi.

Suppliers

Company
Product
Description
Supplier Links
3M Scotch-Weld DP805 Off-White Base (Part B) Potting & Encapsulating Compound - 5 gal - 87233 - 021200-87233 - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
3M Scotch-Weld DP805 Off-White Base (Part B) Potting & Encapsulating Compound - 5 gal - 87233
021200-87233
3M Scotch-Weld DP805 Off-White Base (Part B) Potting & Encapsulating Compound - 5 gal - 87233 021200-87233
3M Scotch-Weld DP805 off-white potting & encapsulating compound is compatible with ceramic, metal, plastic and wood materials with a 24 hr cure time. Provides a 3 to 4 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 3500 psi.

3M Scotch-Weld DP805 off-white potting & encapsulating compound is compatible with ceramic, metal, plastic and wood materials with a 24 hr cure time. Provides a 3 to 4 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 3500 psi.

Buy Now

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Encapsulants and Potting Compounds
Product Number 021200-87233
Product Name 3M Scotch-Weld DP805 Off-White Base (Part B) Potting & Encapsulating Compound - 5 gal - 87233
Unlock Full Specs
to access all available technical data

Similar Products

ELANTAS PDG CONAPOXY AD-10 Epoxy Encapsulant Brown 1 qt Can - AD-10 QT - Ellsworth Adhesives
Specs
Chemical System Epoxy
Dielectric Strength 0.0095 kV/in (0.0037 kV/cm)
View Details
One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation - Supreme 3HTND-2DM - Master Bond, Inc.
Specs
Type High Dielectric; Thermally Conductive
Form / Function Gap Filler, Foam in Place Gasket; Glob Top, Daub, Doming or Overfill
Cure / Technology Thermoset; Single Component
View Details
Light-Curable Materials, Encapsulating, 9101 -  - Dymax
Specs
Cure / Technology UV or Radiation Cured
Viscosity 7000 cP
View Details
Formulations - Applications - Bonding - Tuffbond 65891 - 36589122AB - Hernon Manufacturing, Inc.
Specs
Form / Function 50 ml (two component)
Cure / Technology Two Component  ; Room Temperature Vulcanizing or Curing
Chemical System Elastomeric
View Details