3M 3M Scotch-Weld DP270 Clear Base & Accelerator (B/A) Potting & Encapsulating Compound - 200 ml Dual Cartridge - 87834 62326238300

Description
3M Scotch-Weld DP270 clear potting & encapsulating compound is compatible with aluminum, glass, plastic, rubber and steel materials with a 48 hr cure time. Provides a 60 to 70 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2450 to 2500 psi.
Description
3M Scotch-Weld DP270 clear potting & encapsulating compound is compatible with aluminum, glass, plastic, rubber and steel materials with a 48 hr cure time. Provides a 60 to 70 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2450 to 2500 psi.

Suppliers

Company
Product
Description
Supplier Links
3M Scotch-Weld DP270 Clear Base & Accelerator (B/A) Potting & Encapsulating Compound - 200 ml Dual Cartridge - 87834 - 021200-87834 - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
3M Scotch-Weld DP270 Clear Base & Accelerator (B/A) Potting & Encapsulating Compound - 200 ml Dual Cartridge - 87834
021200-87834
3M Scotch-Weld DP270 Clear Base & Accelerator (B/A) Potting & Encapsulating Compound - 200 ml Dual Cartridge - 87834 021200-87834
3M Scotch-Weld DP270 clear potting & encapsulating compound is compatible with aluminum, glass, plastic, rubber and steel materials with a 48 hr cure time. Provides a 60 to 70 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2450 to 2500 psi.

3M Scotch-Weld DP270 clear potting & encapsulating compound is compatible with aluminum, glass, plastic, rubber and steel materials with a 48 hr cure time. Provides a 60 to 70 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2450 to 2500 psi.

Buy Now

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Encapsulants and Potting Compounds
Product Number 021200-87834
Product Name 3M Scotch-Weld DP270 Clear Base & Accelerator (B/A) Potting & Encapsulating Compound - 200 ml Dual Cartridge - 87834
Thermal Conductivity 0.1770 W/m-K (0.1023 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Formulations - Applications - Potting Epoxies - TUFFBOND 397 - TUFFBOND 397H - Hernon Manufacturing, Inc.
Specs
Cure / Technology Thermoset; Single Component
Chemical System Epoxy
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Electrolube ® 2K301P -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Specs
Type Thermally Conductive
Form / Function Encapsulant or Conformal Coating
Cure / Technology Two Component  
View Details
2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed - QSil-553 - CHT USA Inc.
Specs
Type Thermally Conductive
Cure / Technology Two Component  ; Addition
Features Flame Retardant; UL Rating
View Details
Thermally Conductive, High Temperature Resistant Epoxy Passes NASA Low Outgassing Tests - EP46HT-2AO Black - Master Bond, Inc.
Specs
Type High Dielectric; Thermally Conductive
Form / Function Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
Cure / Technology Thermoset; Two Component  
View Details