3M Thermally Conductive Interface Pad; Insulator Body Material 3M 5519-20

Description
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:4.9W/m. K; Breakdown Voltage Vbr:-; Thickness:2mm; Volume Resistivity:1.7ohm-c m; Thermal Impedance:-; Dielectric Strength:3.1kV/mm RoHS Compliant: Yes
Datasheet
Description
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:4.9W/m. K; Breakdown Voltage Vbr:-; Thickness:2mm; Volume Resistivity:1.7ohm-c m; Thermal Impedance:-; Dielectric Strength:3.1kV/mm RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermally Conductive Interface Pad; Insulator Body Material 3M - 41T5532 - Newark, An Avnet Company
Chicago, IL, United States
Thermally Conductive Interface Pad; Insulator Body Material 3M
41T5532
Thermally Conductive Interface Pad; Insulator Body Material 3M 41T5532
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:4.9W/m. K; Breakdown Voltage Vbr:-; Thickness:2mm; Volume Resistivity:1.7ohm-c m; Thermal Impedance:-; Dielectric Strength:3.1kV/mm RoHS Compliant: Yes

THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:4.9W/m.K; Breakdown Voltage Vbr:-; Thickness:2mm; Volume Resistivity:1.7ohm-cm; Thermal Impedance:-; Dielectric Strength:3.1kV/mm RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41T5532
Product Name Thermally Conductive Interface Pad; Insulator Body Material 3M
Thermal Conductivity 4.9 W/m-K (2.83 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

High quality electrical isolation white silicone RTV glue for heat pipe assemblies - TIV800-10 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Chemical System Silicone
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Epoxy Adhesive with Ultra Low Thermal Resistance - EP48TC - Master Bond, Inc.
Specs
Type High Dielectric; Optical
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Chemical System Epoxy
View Details
Adhesives - 9185012 - RS Components, Ltd.
RS Components, Ltd.
Specs
Form / Shape Liquid; Syringe
View Details