3M Thermally Conductive Interface Pad To-3P; Insulator Body Material 3M 5519-10

Description
THERMALLY CONDUCTIVE INTERFACE PAD TO-3P; Insulator Body Material:-; Thermal Conductivity:4.9W/m. K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:3.1kV/mm RoHS Compliant: Yes
Datasheet
Description
THERMALLY CONDUCTIVE INTERFACE PAD TO-3P; Insulator Body Material:-; Thermal Conductivity:4.9W/m. K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:3.1kV/mm RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermally Conductive Interface Pad To-3P; Insulator Body Material 3M - 41T5531 - Newark, An Avnet Company
Chicago, IL, United States
Thermally Conductive Interface Pad To-3P; Insulator Body Material 3M
41T5531
Thermally Conductive Interface Pad To-3P; Insulator Body Material 3M 41T5531
THERMALLY CONDUCTIVE INTERFACE PAD TO-3P; Insulator Body Material:-; Thermal Conductivity:4.9W/m. K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:3.1kV/mm RoHS Compliant: Yes

THERMALLY CONDUCTIVE INTERFACE PAD TO-3P; Insulator Body Material:-; Thermal Conductivity:4.9W/m.K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:3.1kV/mm RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41T5531
Product Name Thermally Conductive Interface Pad To-3P; Insulator Body Material 3M
Thermal Conductivity 4.9 W/m-K (2.83 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - NH Nonhardening - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Liquid; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 410 F (0 to 210 C)
View Details
Thermal Pads - 625761 - RS Components, Ltd.
RS Components, Ltd.
Specs
Thermal Conductivity 1 W/m-K (0.5778 BTU-ft/hr-ft²-F)
View Details
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity - EP30LP-2 - Master Bond, Inc.
Specs
Type High Dielectric; Optical
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Form / Shape Liquid; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details