3M Thermally Conductive Tape, 19.05Mm X 4.57M; Thermal Conductivity 3M 3/4-5-8805

Description
THERMALLY CONDUCTIVE TAPE, 19.05Mm x 4.57M; Thermal Conductivity:0.6W/m. K; Conductive Material:Acrylic Polymer; Thickness:0.125mm; Thermal Impedance:-; Dielectric Strength:26kV/mm; External Length:4.57m; External Width:19.05mm RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermally Conductive Tape, 19.05Mm X 4.57M; Thermal Conductivity 3M - 99Y6253 - Newark, An Avnet Company
Chicago, IL, United States
Thermally Conductive Tape, 19.05Mm X 4.57M; Thermal Conductivity 3M
99Y6253
Thermally Conductive Tape, 19.05Mm X 4.57M; Thermal Conductivity 3M 99Y6253
THERMALLY CONDUCTIVE TAPE, 19.05Mm x 4.57M; Thermal Conductivity:0.6W/m. K; Conductive Material:Acrylic Polymer; Thickness:0.125mm; Thermal Impedance:-; Dielectric Strength:26kV/mm; External Length:4.57m; External Width:19.05mm RoHS Compliant: Yes

THERMALLY CONDUCTIVE TAPE, 19.05Mm x 4.57M; Thermal Conductivity:0.6W/m.K; Conductive Material:Acrylic Polymer; Thickness:0.125mm; Thermal Impedance:-; Dielectric Strength:26kV/mm; External Length:4.57m; External Width:19.05mm RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 99Y6253
Product Name Thermally Conductive Tape, 19.05Mm X 4.57M; Thermal Conductivity 3M
Thermal Conductivity 0.6000 W/m-K (0.3467 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

One Component Glob Top Epoxy Meets NASA Low Outgassing Specifications - EP17HTND-CCM - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Die Bonding Adhesives; Flowable Paste; Grease, Paste
View Details
Carbon Fiber Thermal Gap Fillers - CF210A - Fujipoly® America Corp.
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Use Temperature -40 to 302 F (-40 to 150 C)
View Details
2-Part, Silicone Potting Compound and Encapsulant, UL Listed - QSil-563 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics
Features Flame Retardant; UL Rating
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details