3M Aerospace and Aircraft Maintenance Division 3M™ Scotch-Weld™ Structural Void Filling Compound SW 3500-2 B/A

Description
A two-part, high temperature curing, void filling compound. It is designed for honeycomb sandwich constructions, honeycomb splicing and reinforcement, mismatch areas filling, and inserts bonding. Offers the following advantages: High performance from -55°C to + 175°C, convenient 1:1 mix ratio by weight, thixotropic for ease of application, long work life at 15-25°C, low volatiles loss during cure. Cures from 120°C to 175°C in one hour. Low cured density. Excellent water and chemical resistance. Room temperature storage of the two compounds.
Description
A two-part, high temperature curing, void filling compound. It is designed for honeycomb sandwich constructions, honeycomb splicing and reinforcement, mismatch areas filling, and inserts bonding. Offers the following advantages: High performance from -55°C to + 175°C, convenient 1:1 mix ratio by weight, thixotropic for ease of application, long work life at 15-25°C, low volatiles loss during cure. Cures from 120°C to 175°C in one hour. Low cured density. Excellent water and chemical resistance. Room temperature storage of the two compounds.

Suppliers

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Product
Description
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3M™ Scotch-Weld™ Structural Void Filling Compound - SW 3500-2 B/A - 3M Aerospace and Aircraft Maintenance Division
St. Paul, MN, USA
3M™ Scotch-Weld™ Structural Void Filling Compound
SW 3500-2 B/A
3M™ Scotch-Weld™ Structural Void Filling Compound SW 3500-2 B/A
A two-part, high temperature curing, void filling compound. It is designed for honeycomb sandwich constructions, honeycomb splicing and reinforcement, mismatch areas filling, and inserts bonding. Offers the following advantages: High performance from -55°C to + 175°C, convenient 1:1 mix ratio by weight, thixotropic for ease of application, long work life at 15-25°C, low volatiles loss during cure. Cures from 120°C to 175°C in one hour. Low cured density. Excellent water and chemical resistance. Room temperature storage of the two compounds.

A two-part, high temperature curing, void filling compound. It is designed for honeycomb sandwich constructions, honeycomb splicing and reinforcement, mismatch areas filling, and inserts bonding.

Offers the following advantages: High performance from -55°C to + 175°C, convenient 1:1 mix ratio by weight, thixotropic for ease of application, long work life at 15-25°C, low volatiles loss during cure. Cures from 120°C to 175°C in one hour. Low cured density. Excellent water and chemical resistance. Room temperature storage of the two compounds.

Supplier's Site

Technical Specifications

  3M Aerospace and Aircraft Maintenance Division
Product Category Industrial Sealants
Product Number SW 3500-2 B/A
Product Name 3M™ Scotch-Weld™ Structural Void Filling Compound
Cure / Technology Thermoset; Single Component
Type / Form Grease, Paste
Substrate Compatibility Honeycomb Core
Chemical System Epoxy
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