Lapping Services
Service Detail from Bullen Ultrasonics, Inc.




Ultrasonic machining is a low material removal rate (MRR), loose abrasive machining process in which the mirror image of a shaped tool can be created in hard, brittle materials. Material removal is achieved by the direct and indirect hammering of abrasive particles against a workpiece by means of an ultrasonically vibrating tool.
- A nearly limitless number of feature shapes—including round, square, and odd-shaped thru-holes, and cavities of varying depths, as well as OD-ID features—can be machined with high quality and consistency.
- Features ranging in size from 0.008" up to several inches are possible in small workpieces, wafers, larger substrates, and material blanks.
- Aspect ratios as high as 25-to-1 are possible, depending on the material type and feature size. View the ultrasonic machining 3D animation to learn more about how ultrasonic machining works.
Specifications
Company Information
Single and double sided lapping and polishing of borosilicate glass wafers. Suitable for anodic bonding. Superior finish & Parallelism. Your source for high quality polished glass substrates. Structured glass substrates for MEMS applications.
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