Henkel Corporation - Electronics Hysol ECCOBOND CA3152 8799538544641

Name: Hysol ECCOBOND CA3152
Brand: Henkel Corporation - Electronics

Description

Snap curable, low temperature cure, electrically conductive adhesive with excellent adhesion and reliability of Cu and Al substrates.

Suppliers

Company

Product

Description

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Irvine, CA, USA

Hysol ECCOBOND CA3152
8799538544641

Hysol ECCOBOND CA3152 8799538544641

Snap curable, low temperature cure, electrically conductive adhesive with excellent adhesion and reliability of Cu and Al substrates.

Supplier's Site

	Henkel Corporation - Electronics
Product Category	Industrial Adhesives
Product Number	8799538544641
Product Name	Hysol ECCOBOND CA3152
Industry	Electronics

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Master Bond, Inc.

Specs

Cure / Technology Thermoset; Two Component

Type / Form Liquid

Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Metal/Plastic/Glass/Ceramic/Elast.&Wood

TE Connectivity

Shenzhen DeepMaterial Technologies Co., Ltd

Specs

Cure / Technology UV or Radiation Cured; Reactive or Moisture Cured

RS Components, Ltd.

Specs

Chemical System Elastomeric

Type / Form Gel

Use Temperature 158 F (70 C)