Henkel Corporation - Electronics Datasheets for Industrial Adhesives

Industrial adhesives consist of hot melt adhesives, epoxy adhesives, polyurethane adhesives, sealants, thermoset adhesives, UV curing adhesives, silicon adhesives, acrylic adhesives and other related industrial products.
Industrial Adhesives: Learn more

Product Name Notes
LOCTITE ABLESTIK 2035SC (Known as Ablebond 2035SC) -- 8802575024129 (Known as Ablebond 2035SC ) LOCTITE ABLESTIK 2035SC is non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize...
LOCTITE ABLESTIK 2035SC-1B1 (Known as Ablebond 2035SC-1B1) -- 8799581143041 (Known as Ablebond 2035SC-1B1 ) LOCTITE ABLESTIK 2035SC-1B1 non-conductive, one component die attach adhesive was formulated for high throughput die attach applications. It is designed for die attach applications requiring...
LOCTITE ABLESTIK 2053S (Known as Ablebond 2053S) -- 8799471042561 (Known as Ablebond 2053S ) LOCTITE ABLESTIK 2053S is a low stress adhesive for die-to-substrate applications.
LOCTITE ABLESTIK 342-37 (Known as Ablebond 342-37 ) -- 8799555878913 (Known as Ablebond 342-37 ) LOCTITE ABLESTIK 342-37 epoxy adhesive is designed for applications requiring outstanding thermal shock properties.
LOCTITE ABLESTIK 8175 (Known as Ablebond 8175) -- 8799472418817 (Known as Ablebond 8175 ) LOCTITE ABLESTIK 8175 is an electrically conductive adhesive for solder replacement and microelectronic interconnect applications.
LOCTITE ABLESTIK 8350R (Known as Ablebond 8350R) -- 8799556206593 (Known as Ablebond 8350R ) LOCTITE ABLESTIK 8350R is a snap curable die attach adhesive designed to provide anti-delamination and package reliability.
LOCTITE ABLESTIK 84-1LMI (Known as ABLEBOND 84-1LMI) -- 8799473172481 (Known as ABLEBOND 84-1LMI ) LOCTITE ABLESTIK 84-1LMI enhanced thermal conductivity, fast cure, low stress die & component attach adhesive optimized for GaAs MMIC attach.
LOCTITE ABLESTIK 84-3 (Known as Ablebond 84-3) -- 8799475990529 (Known as Ablebond 84-3 ) LOCTITE ABLESTIK 84-3 is an exceptionally low thermal resistance. Superior contact resistance and adhesion stability on Sn, SnPb and OSP Cu. Very low weight loss...
LOCTITE ABLESTIK 967-3 (Known as Ablebond 967-3) -- 8799475564545 (Known as Ablebond 967-3 ) LOCTITE ABLESTIK 967-3 is a two component, solvent-free adhesive designed for applications that require lower-than-normal cure temperatures.
LOCTITE ABLESTIK GA2W (Known as Ablebond GA-2W) -- 8799473500161 (Known as Ablebond GA-2W ) LOCTITE ABLESTIK GA2W is a single component adhesive is designed for CCD/CMOS die attach bonding applications. This adhesive can be cured using directed heat energy...
LOCTITE ECCOBOND MC 723 (Known as Ablebond MC723) -- 8799476023297 (Known as Ablebond MC723 ) LOCTITE ECCOBOND MC 723 is for bondline control achieved with 75 micron spacers. Compatible with silicone TIM.
LOCTITE ABLESTIK 2025D (Known as Ablestik ABLEBOND 2025D) -- 8799554174977 (Known as Ablestik ABLEBOND 2025D ) LOCTITE ABLESTIK 2025D is a hybrid chemistry die attach adhesive designed for PBGA.
LOCTITE ABLESTIK 2025DSI (Known as ABLESTIK ABLEBOND 2025DSI) -- 8799554240513 (Known as ABLESTIK ABLEBOND 2025DSI ) LOCTITE ABLESTIK 2025DSI is a non-conductive low bleed adhesive.
LOCTITE ECCOBOND 3003 (Known as ABLESTIK ABLEBOND 3003) -- 8799471730689 (Known as ABLESTIK ABLEBOND 3003 ) LOCTITE ECCOBOND 3003 adhesive is designed for lid attach in flip chip BGA applications. The combination of product features result in superior flip chip...
LOCTITE ECCOBOND 3005 (Known as ABLESTIK ABLEBOND 3005) -- 8799472058369 (Known as ABLESTIK ABLEBOND 3005 ) LOCTITE ECCOBOND 3005 adhesive is designed for lid attach in flip chip BGA applications. The combination of product features result in superior flip chip...
LOCTITE ABLESTIK 8177 (Known as Ablestik ABLEBOND 8177) -- 8799537496065 (Known as Ablestik ABLEBOND 8177 ) LOCTITE ABLESTIK 8177 is a fast, general conductive, low temperature cure, electrically & thermally conductive adhesive. Ideally suited for low stress die & component...
LOCTITE ABLESTIK 8387A (Known as ABLESTIK ABLEBOND 8387A) -- 8799580323841 (Known as ABLESTIK ABLEBOND 8387A ) LOCTITE ABLESTIK 8387A is a non-conductive die attach adhesive designed for high throughput smart card bonding applications.
LOCTITE ABLESTIK 8387B-1B2 (Known as ABLESTIK ABLEBOND 8387B-1B2) -- 8799582224385 (Known as ABLESTIK ABLEBOND 8387B-1B2 ) LOCTITE ABLESTIK 8387B-1B2 non-conductive die attach adhesive contains 50 μm polymer spacers for bondline control. It contains a black pigmentation for blocking stray light.
LOCTITE ABLESTIK 8387BSW (Known as ABLESTIK ABLEBOND 8387BSW) -- 8799581011969 (Known as ABLESTIK ABLEBOND 8387BSW ) LOCTITE ABLESTIK 8387BSW is a single component, non-conductive adhesive designed for high throughput bonding applications. Used for image sensor bonding on camera modules. It...
LOCTITE ABLESTIK 8700E (Known as ABLESTIK ABLEBOND 8700E) -- 8799475040257 (Known as ABLESTIK ABLEBOND 8700E ) LOCTITE ABLESTIK 8700E is an electrically conductive epoxy adhesive with high shear strength after thermal cycling.
LOCTITE ABLESTIK 8900NC (Known as Ablestik ABLEBOND 8900NC) -- 8799473434625 (Known as Ablestik ABLEBOND 8900NC ) LOCTITE ABLESTIK 8900NC is a die attach adhesive has been formulated for use in high throughput die attach applications. Actual performance will depend on...
LOCTITE ABLESTIK 958-11 (Known as ABLESTIK ABLEBOND 958-11) -- 8799475105793 (Known as ABLESTIK ABLEBOND 958-11 ) An electrically insulating adhesive designed to absorb stress produced when bonding large ICs.
LOCTITE ABLESTIK 8006NS (Known as Ablestik ABLECOAT 8006NS) -- 8799476383745 (Known as Ablestik ABLECOAT 8006NS ) LOCTITE ABLESTIK 8006NS is a non-conductive oven cure adhesive utilizing wafer backside coating technology.
LOCTITE ECCOBOND UF 8828 (Known as ABLESTIK ABLEFILL UF8828) -- 8799554502657 (Known as ABLESTIK ABLEFILL UF8828 ) LOCTITE ECCOBOND UF 8828 is for eutectic, high lead or lead-free packaging. Higher modulus.
LOCTITE ECCOBOND UF 8829 (Known as ABLESTIK ABLEFILL UF8829) -- 8799501516801 (Known as ABLESTIK ABLEFILL UF8829 ) LOCTITE ECCOBOND UF 8829 is for small die in lead-free and low k applications. Higher modulus, lowest CTE.
LOCTITE ABLESTIK 551 (Known as ABLESTIK ABLEFILM 551) -- 8799581634561 (Known as ABLESTIK ABLEFILM 551 ) LOCTITE ABLESTIK 551 is a flexible unsupported adhesive film is designed to produce tough, resilient bonds between materials with differing coefficients of thermal expansion.
LOCTITE ABLESTIK 6200 (Known as Ablestik ABLEFLEX 6200) -- 8799479070721 (Known as Ablestik ABLEFLEX 6200 ) LOCTITE ABLESTIK 6200 is a B-stageable printable paste with low moisture uptake and bleed.
LOCTITE ABLESTIK 6202C-X (Known as Ablestik ABLEFLEX 6202C-X) -- 8799473893377 (Known as Ablestik ABLEFLEX 6202C-X ) LOCTITE ABLESTIK 6202C-X is a B-stageable adhesive is ideal for laminate-based packages where tolerance and bleed need to be minimized. This low modulus adhesive...
LOCTITE ECCOBOND LUX A4035T (Known as ABLESTIK ABLELUX A4035T) -- 8799556632577 (Known as ABLESTIK ABLELUX A4035T ) LOCTITE ECCOBOND LUX A4035T photocurable adhesive is formulated to enhance productivity in the assembly of optical, fiber optic, and optoelectronic devices. In addition to...
LOCTITE ECCOBOND LUX A4083T (Known as ABLESTIK ABLELUX A4083T) -- 8799580585985 (Known as ABLESTIK ABLELUX A4083T ) LOCTITE ECCOBOND LUX A4083T photocurable adhesive is formulated to enhance productivity in the assembly of optical, fiber optic and optoelectronic devices.
LOCTITE ABLESTIK LHA 2 (Known as ABLESTIK ABLELUX LHA-2) -- 8799473696769 (Known as ABLESTIK ABLELUX LHA-2 ) LOCTITE ABLESTIK LHA 2 is an adhesive paste is designed for lens holder attach for camera module applications. It can be cured at low...
LOCTITE ECCOBOND LUX OGR150THTG (Known as Ablestik ABLELUX OGR150THTG) -- 8799473762305 (Known as Ablestik ABLELUX OGR150THTG ) Photocurable adhesive is designed for high throughput optoelectronic assembly operations. This product also contains a secondary thermal cure mechanism for applications that contain shadowed...
LOCTITE ABLESTIK ABP 8611 (Known as ABLESTIK ABP 8611 Die attach adhesive) -- 8802607169537 (Known as ABLESTIK ABP 8611 Die attach adhesive ) LOCTITE ABLESTIK ABP 8611 adhesive is designed for die attach applications as well as component attach. Its high dielectric property helps...
LOCTITE ABLESTIK ACP 3122 (Known as ABLESTIK ACP-3122) -- 8802580987905 (Known as ABLESTIK ACP-3122 ) LOCTITE ABLESTIK ACP 3122 is an anisotropic epoxy adhesive is designed for high throughput microelectronics assembly applications. This adhesive conducts in only one direction, making...
LOCTITE ABLESTIK ATB 105US (Known as Ablestik ATB-105) -- 8799501451265 (Known as Ablestik ATB-105 ) LOCTITE ABLESTIK ATB 105US is a single layer format die attach film (5 µm).
LOCTITE ABLESTIK ATB 115US (Known as Ablestik ATB-115US) -- 8799555485697 (Known as Ablestik ATB-115US ) LOCTITE ABLESTIK ATB 115US adhesive film (15 µm) is formulated for use in wafer lamination processess and preform decal. It is designed for use in...
LOCTITE ABLESTIK ATB 120 (Known as Ablestik ATB-120) -- 8799480348673 (Known as Ablestik ATB-120 ) LOCTITE ABLESTIK ATB 120 is a single layer format die attach film (20 µm).
LOCTITE ABLESTIK ATB 125US (Known as Ablestik ATB-125US) -- 8799555584001 (Known as Ablestik ATB-125US ) LOCTITE ABLESTIK ATB 125US is an adhesive film (25 µm) is formulated for use in wafer lamination processess and preform decal. It is designed for...
LOCTITE ABLESTIK ATB 130 (Known as Ablestik ATB-130) -- 8799501418497 (Known as Ablestik ATB-130 ) LOCTITE ABLESTIK ATB 130 is a single layer format die attach film (30 µm).
LOCTITE ABLESTIK CA3556HF (Known as ABLESTIK CA3556HF) -- 8799538610177 (Known as ABLESTIK CA3556HF ) Loctite Ablestik CA3556HF is an electrically conductive adhesive designed for applications that require a very fast cure at low temperatures. It is ideally suited for...
LOCTITE ABLESTIK ICP 3556M1 (Known as ABLESTIK ICP 3556M1 Electrically conductive adhesive) -- 8799582093313 (Known as ABLESTIK ICP 3556M1 Electrically conductive adhesive ) LOCTITE ABLESTIK ICP 3556M1 is a one component, snap curable electrically conductive adhesive designed for applications that require a very fast...
LOCTITE ABLESTIK ICP 3601 (Known as ABLESTIK ICP 3601) -- 8802608971777 (Known as ABLESTIK ICP 3601 ) LOCTITE ABLESTIK ICP 3601 electrically conductive epoxy paste is specifically formulated for capacitor component assembly. It has excellent contact resistance and high bond strength.
LOCTITE ABLESTIK ICP 3801 (Known as ABLESTIK ICP-3801 conductive adhesive) -- 8802607267841 (Known as ABLESTIK ICP-3801 conductive adhesive ) LOCTITE ABLESTIK ICP 3801 is a one component electically conductive epoxy designed to provide lower and more stable costs compared to materials relying...
LOCTITE ABLESTIK ICP 4298 Silicone based electrically conductive adhesive (Known as Ablestik ICP-4298) -- 8802611593217 (Known as Ablestik ICP-4298 ) LOCTITE ABLESTIK ICP 4298 is a one-component, silicone based, electrically conductive adhesive. It is specially designed for applications where both high flexibility and excellent conductivity...
LOCTITE ABLESTIK CE3850 (Known as CE-3850) -- 8799581896705 (Known as CE-3850 ) LOCTITE ABLESTIK CE3850 one component electrically conductive adhesive is desgined for circuit assembly applications It is specifically recommended for mounting low cost tin (Sn) and nickel...
LOCTITE ABLESTIK CE3920 (Known as CE-3920) -- 8799539429377 (Known as CE-3920 ) LOCTITE ABLESTIK CE3920 is an electrically conductive adhesive for thin film PV assembly with superior contact resistance stability. Viscosity optimized for dispensing.
LOCTITE ABLESTIK ATB F125E (Known as EASY STACK ATB-F125E-8) -- 8799579504641 (Known as EASY STACK ATB-F125E-8 ) LOCTITE ABLESTIK ATB-F125E Adhesive Film Die Attach is formulated for use in wafer lamination processes or as a preform decal.
LOCTITE ABLESTIK 2332 (Known as ECCOBOND 2332) -- 8799502499841 (Known as ECCOBOND 2332 ) LOCTITE ABLESTIK 2332 is a solventless epoxy adhesive that develops high bond strength when cured at temperatures as low as 100°C.
LOCTITE ABLESTIK 282 (Known as ECCOBOND 282) -- 8799502073857 (Known as ECCOBOND 282 ) LOCTITE ABLESTIK 282 is an one component, silk screenable, viscous epoxy with high thermal conductivity.
LOCTITE ABLESTIK 285 (Known as ECCOBOND 285) -- 8799502237697 (Known as ECCOBOND 285 ) LOCTITE ABLESTIK 285 is a highly filled, thermally conductive, thixotropic epoxy paste with low CTE.
LOCTITE ABLESTIK 927-10 (Known as ECCOBOND 927-10) -- 8799577767937 (Known as ECCOBOND 927-10 ) LOCTITE ABLESTIK 927-10 one component epoxy adhesive is designed for medical applications. It is also recommended for bonding, sealing or insulating heat sensitive parts. It...
LOCTITE ABLESTIK A164-1 (Known as ECCOBOND A-164-1) -- 8802590326785 (Known as ECCOBOND A-164-1 ) LOCTITE ABLESTIK A164-1 is an enhanced thermal conductivity, fast cure, low stress die and component attach adhesive optimized for GaAs MMIC attach.
LOCTITE ABLESTIK A401 (Known as ECCOBOND A-401) -- 8802590359553 (Known as ECCOBOND A-401 ) LOCTITE ABLESTIK A401 has good thermal conductivity; good high temperature resistance; bonds well to metal, glass, plastics and ceramics.
LOCTITE ABLESTIK C 850-5A 114 (Known as ECCOBOND C-850-5A) -- 8802611658753 (Known as ECCOBOND C-850-5A ) LOCTITE ABLESTIK C 850-5A 114 is an electrically conductive adhesive designed for LED die bonding and other die attach applications. KEY BENEFITS: One Component Fast...
LOCTITE ABLESTIK C850-6L (Known as ECCOBOND C-850-6L) -- 8799537987585 (Known as ECCOBOND C-850-6L ) LOCTITE ABLESTIK C850-6L is a low viscosity version of C850-6.
LOCTITE ECCOBOND DP 1005 (Known as Eccobond DP1005) -- 8802603302913 (Known as Eccobond DP1005 ) LOCTITE ECCOBOND DP 1005 jet dispensable die attach adhesive is designed for bonding low energy plastic on metal substrates. It is chemical resistant and has...
LOCTITE ABLESTIK DX10 (Known as ECCOBOND DX-10C) -- 8799539822593 (Known as ECCOBOND DX-10C ) LOCTITE ABLESTIK DX10 is epoxy base clear type. Low viscosity.
LOCTITE EDAG PF-021 E&C (Known as Electrodag PF-021 UV Curable Encapsulant) -- 8799559680001 (Known as Electrodag PF-021 UV Curable Encapsulant ) LOCTITE EDAG PF-021 E&C is a dot dispensable, UV curable encapsulating photopolymer designed to secure low profile surface mount devices to rigid...
LOCTITE ECCOBOND DP 1004 (Known as HYSOL DP1004) -- 8802595635201 (Known as HYSOL DP1004 ) LOCTITE ECCOBOND DP 1004 is designed for bonding dissimilar substrates commonly used in ink jet applications and other MEMS devices.
LOCTITE ECCOBOND E 3239 (Known as Hysol E-3239) -- 8799551848449 (Known as Hysol E-3239 ) LOCTITE ECCOBOND E 3239 was designed as a chemically resistant fast and low temperature heat curing adhesive for bonding dissimilar engineering substrates commonly used in...
LOCTITE ABLESTIK 2332-17 (Known as HYSOL ECCOBOND 2332-17) -- 8799574523905 (Known as HYSOL ECCOBOND 2332-17 ) LOCTITE ABLESTIK 2332-17 is a solventless one component epoxy adhesive that develops high bond strength when cured at temperatures as low as 100 to...
LOCTITE ABLESTIK 45 BK (Known as Hysol ECCOBOND 45-Catalyst 15) -- 8799536873473 (Known as Hysol ECCOBOND 45-Catalyst 15 ) A two component, room temperature curing, variable flexibility epoxy adhesive.
LOCTITE ABLESTIK 56C-CAT 11 KIT (Known as Hysol ECCOBOND 56C/CAT 11) -- 8802594422785 (Known as Hysol ECCOBOND 56C/CAT 11 ) LOCTITE ABLESTIK 56C-CAT 11 KIT ia an adhesive designed to make electrical connections where hot soldering is impractical or to make electrical connections...
LOCTITE ABLESTIK 57C (Known as Hysol ECCOBOND 57C) -- 8799502630913 (Known as Hysol ECCOBOND 57C ) LOCTITE ABLESTIK 57C is a convenient 1:1 mix ratio. High electrical and thermally conductive two component adhesive.
LOCTITE STYCAST A 316-48 (Known as Hysol ECCOBOND A316-48) -- 8802590621697 (Known as Hysol ECCOBOND A316-48 ) A one component, oxide-filled, pourable epoxy adhesive with exceptional thermal stability.
LOCTITE ABLESTIK CA 3150 (Known as Hysol ECCOBOND CA3150) -- 8799538315265 (Known as Hysol ECCOBOND CA3150 ) Snap curable, low temperature cure, electrically conductive adhesive with excellent adhesion and reliability of Cu and Al substrates.
LOCTITE ABLESTIK CE 3126 (Known as Hysol ECCOBOND CE3126) -- 8799539101697 (Known as Hysol ECCOBOND CE3126 ) Snap curable anisotropic adhesive is especially suited in applications where throughtput is critical. This product is typically used for very fine pitch flip chip...
LOCTITE ABLESTIK CE 8500 (Known as Hysol ECCOBOND CE8500) -- 8799539494913 (Known as Hysol ECCOBOND CE8500 ) One component, general conductive, low stress adhesive for mismatched CTE applications. High thermal conductivity.
LOCTITE ABLESTIK CT4042-1 PTA (Known as HYSOL ECCOBOND CT4042-1 A/B) -- 8799574687745 (Known as HYSOL ECCOBOND CT4042-1 A/B ) LOCTITE ABLESTIK CT4042-1 PTA is a two component silver-filled, easy to apply, conductive epoxy paste adhesive. It is recommended for chip bonding in...
LOCTITE ABLESTIK CT 5047-2 KIT (Known as HYSOL ECCOBOND CT5047-2 A/B) -- 8799574786049 (Known as HYSOL ECCOBOND CT5047-2 A/B ) LOCTITE ABLESTIK CT 5047-2 KIT is a two component electrically conductive adhesive designed to make electrical connections where hot soldering is impractical or...
LOCTITE STYCAST E 1470 (Known as Hysol ECCOBOND E1470) -- 8799540084737 (Known as Hysol ECCOBOND E1470 ) B-stage capable adhesive designed for component and lid attach applications. Bonds well to engineering plastics such as LCP, as well as silicon and metals...
LOCTITE ECCOBOND E 3200 (Known as Hysol ECCOBOND E3200) -- 8799540379649 (Known as Hysol ECCOBOND E3200 ) LOCTITE ECCOBOND E 3200 is a very fast and low temperature curing one component adhesive with good flexibility, chemical and humidity resistance.
LOCTITE ABLESTIK E 3526 (Known as HYSOL ECCOBOND E3526-5) -- 8799574654977 (Known as HYSOL ECCOBOND E3526-5 ) LOCTITE ABLESTIK E 3526 is especially developed for ferrite core bonding applications. It is formulated to have high bond strength when cured at temperatures...
LOCTITE E 6752 (Known as Hysol ECCOBOND E6752) -- 8799540183041 (Known as Hysol ECCOBOND E6752 ) LOCTITE E 6752 is a one component, low temperature cure, surface mount adhesive that can be applied easily without stringing.
Hysol ECCOBOND G500HF (Known as Hysol ECCOBOND G500HF) -- 8799549882369 (Known as Hysol ECCOBOND G500HF ) General purpose one-component non-conductive epoxy adhesive and sealant that cures to a high gloss finish.
LOCTITE ABLESTIK G 909 (Known as Hysol ECCOBOND G909) -- 8802589933569 (Known as Hysol ECCOBOND G909 ) LOCTITE ABLESTIK G 909 is a one component snap curable electrically conductive adhesive.
LOCTITE ECCOBOND UV 9000 (Known as Hysol ECCOBOND UV 9000) -- 8799536021505 (Known as Hysol ECCOBOND UV 9000 ) One component, low temperature curing thermally conductive epoxy adhesive.
LOCTITE ABLESTIK XCE 3111 (Known as Hysol ECCOBOND XCE3111) -- 8799470092289 (Known as Hysol ECCOBOND XCE3111 ) One component, snap curable, electrically conductive adhesive.
LOCTITE EO7029 (Known as HYSOL EO7029) -- 8799576260609 (Known as HYSOL EO7029 ) LOCTITE EO7029 is one component encapsulant is formulated for use in smart card applications. The thixotropic property of this material is designed to avoid flow...
LOCTITE ECCOBOND FP4549HT (Known as Hysol FP4549HT) -- 8799543853057 (Known as Hysol FP4549HT ) LOCTITE ECCOBOND FP4549HT is an aluminum nitride-filled version of FP4549 for high thermal applications.
LOCTITE HYSOL GR 838LC (Known as Hysol GR838LC) -- 8799436767233 (Known as Hysol GR838LC ) LOCTITE HYSOL GR 838LC is low stress, excellent gate leakage performance.
LOCTITE HYSOL KL-G800H CD (Known as Hysol KL-G800H) -- 8802596552705 (Known as Hysol KL-G800H ) LOCTITE HYSOL KL-G 800H CD is a green epoxy molding compound suitable for thin leaded packages. It is designed to achieve JEDEC level 2. It...
LOCTITE ABLESTIK QMI 5200-1X (Known as HYSOL QMI5200-1X adhesive film) -- 8799578030081 (Known as HYSOL QMI5200-1X adhesive film ) LOCTITE ABLESTIK QMI 5200-1X adhesive film is formulated for use in wafer lamination processes or as a preform decal. It is designed for...
LOCTITE ABLESTIK QMI536NB (Known as Hysol QMI536NB) -- 8799541657601 (Known as Hysol QMI536NB ) LOCTITE ABLESTIK QMI536NB has high JEDEC performance for first die and die-to-die bonding. Non-conductive and non-damaging to the die face. Can be cured as low...
LOCTITE ABLESTIK QMI536NB-1A5 (Known as HYSOL QMI536NB-1A5) -- 8799551193089 (Known as HYSOL QMI536NB-1A5 ) LOCTITE ABLESTIK QMI536NB-1A5 is a non-conductive die attach paste deisgned for applications requiring good dielectric strength.
LOCTITE ABLESTIK QMI538NB (Known as Hysol QMI538NB) -- 8802589671425 (Known as Hysol QMI538NB )
LOCTITE ABLESTIK QMI538NB-1A2 (Known as Hysol QMI538NB-1A2) -- 8799549325313 (Known as Hysol QMI538NB-1A2 ) LOCTITE ABLESTIK QMI538NB-1A2 is a non-conductive paste for leadframe applications. Very low stress QMI538NB°1A2, 1A3, 1A4 for die sizes greater than 500 x 500 mil.
LOCTITE ABLESTIK QMI547 (Known as Hysol QMI547) -- 8799549227009 (Known as Hysol QMI547 ) LOCTITE ABLESTIK QMI547 is a non-conductive paste for leadframe applications.
LOCTITE ABLESTIK A316 (Known as HYSOL STYCAST A316 Series) -- 8802597535745 (Known as HYSOL STYCAST A316 Series ) LOCTITE ABLESTIK A316 series epoxy adhesive and sealant is designed for high throughput assembly operations.
LOCTITE ABLESTIK 2106 BIPAX (Known as HYSOL TRA-BOND 2106) -- 8799575048193 (Known as HYSOL TRA-BOND 2106 ) LOCTITE ABLESTIK 2106 BIPAX is a two component epoxy is designed for high strength structural bonding applications. It develops significant properties 1 hour after...
LOCTITE ABLESTIK 2106T BIPAX (Known as HYSOL TRA-BOND 2106T) -- 8799575146497 (Known as HYSOL TRA-BOND 2106T ) LOCTITE ABLESTIK 2106T BIPAX is a two component epoxy designed for high strength structural bonding applications. It develops significant properties one hour after mixing.
LOCTITE ABLESTIK 2115 (Known as Hysol TRA-BOND 2115) -- 8799570493441 (Known as Hysol TRA-BOND 2115 ) LOCTITE ABLESTIK 2115 is a clear, low viscosity epoxy formulation used in the fabrication of lasers. It is capable of withstanding 30 seconds of...
LOCTITE ABLESTIK 2116 BIPAX (Known as HYSOL TRA-BOND 2116) -- 8799571214337 (Known as HYSOL TRA-BOND 2116 ) LOCTITE ABLESTIK 2116 BIPAX is a thixotropic, non-conductive, solvent-free, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It offers chemical resistance...
LOCTITE ABLESTIK 2151 (Known as Hysol TRA-BOND 2151) -- 8802592948225 (Known as Hysol TRA-BOND 2151 ) LOCTITE ABLESTIK 2151 is a thixotropic, two-part adhesive that develops strong, durable high-impact bonds at room temperature which improve heat transfer while maintaining electrical...
LOCTITE ECCOBOND F 112 (Known as Hysol TRA-BOND F112) -- 8799571378177 (Known as Hysol TRA-BOND F112 ) LOCTITE ECCOBOND F 112 is a long pot life, impact resistant, fiber-optic adhesive. This two-part, low viscosity epoxy paste adhesive has the distinct advantage...
LOCTITE ECCOBOND F 114 BIPAX (Known as Hysol TRA-BOND F114) -- 8799571574785 (Known as Hysol TRA-BOND F114 ) LOCTITE ECCOBOND F 114 BIPAX is an optically clear, blush-free, low viscosity, room temperature cure, epoxy system with good optical properties that contains no...
LOCTITE ECCOBOND F 123 TRAPAX (Known as Hysol TRA-BOND F123) -- 8799571836929 (Known as Hysol TRA-BOND F123 ) LOCTITE ECCOBOND F 123 TRAPAX is a low viscosity formulation that signals both proper mixing and curing when bonding fiber-optic bundles, potting glass fibers...
LOCTITE ECCOBOND F 253 BIPAX (Known as Hysol TRA-BOND F253) -- 8799571869697 (Known as Hysol TRA-BOND F253 ) LOCTITE ECCOBOND F 253 BIPAX is a low viscosity, high temperature, two-part epoxy formulation that changes color during the curing process to indicate cure...
LOCTITE ABLESTIK FDA 2 (Known as Hysol TRA-BOND FDA2) -- 8799572131841 (Known as Hysol TRA-BOND FDA2 ) A thixotropic epoxy resin paste system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests in...
LOCTITE ABLESTIK FDA 2T (Known as Hysol TRA-BOND FDA2T) -- 8799570427905 (Known as Hysol TRA-BOND FDA2T ) LOCTITE ABLESTIK FDA 2T is a thixotropic epoxy resin paste system specifically developed for medical device applications. It has been tested in accordance with...
LOCTITE ECCOBOND FS 245 BIPAX (Known as Hysol Tra-Cast FS245) -- 8799551750145 (Known as Hysol Tra-Cast FS245 ) LOCTITE ECCOBOND FS 245 BIPAX is a thixotropic, two-part adhesive that develops strong, durable, high impact bonds at room temperature which improve heat transfer...
LOCTITE ABLESTIK 2902 (Known as Hysol TRA-DUCT 2902) -- 8799572262913 (Known as Hysol TRA-DUCT 2902 ) LOCTITE ABLESTIK 2902 is a silver-filled epoxy recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties.
LOCTITE ABLESTIK 2958 (Known as Hysol TRA-DUCT 2958) -- 8799570395137 (Known as Hysol TRA-DUCT 2958 ) LOCTITE ABLESTIK 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components recommended for electronic, microelectronic and die-attach bonding...
LOCTITE ECCOBOND UV 3000 (Known as HYSOL UV3000) -- 8802595995649 (Known as HYSOL UV3000 ) LOCTITE ECCOBOND UV 3000 is a UV curable adhesive designed for high throughput assembly operations. This adhesive can withstand exposure to temperatures as high as...
LOCTITE ECCOBOND UV 3000LH (Known as HYSOL UV3000LH) -- 8799574065153 (Known as HYSOL UV3000LH ) LOCTITE ECCOBOND UV 3000LH cure adhesive is designed for high throughput assembly operations. A low halide version of UV3000. It is used in CMOS glass...
LOCTITE ABLESTIK XCE 3104XL (Known as HYSOL XCE3104XL) -- 8802596651009 (Known as HYSOL XCE3104XL ) LOCTITE ABLESTIK XCE 3104XL is an electrically conductive adhesive with tin compatibility for the stencil and screen print applications. It uses a unique blend of...
LOCTITE ABLESTIK XCE 3120 (Known as HYSOL XCE3120) -- 8799575408641 (Known as HYSOL XCE3120 ) LOCTITE ABLESTIK XCE 3120 anisotropic epoxy adhesive is designed for high throughput microelectronics assembly applications. It is ideal for use in combination with temperature sensitive...
LOCTITE ABLESTIK XCP3302NS ITAR (Known as HYSOL XCP3302NS) -- 8799574360065 (Known as HYSOL XCP3302NS ) LOCTITE ABLESTIK XCP3302NS ITAR gold filled, electrically conductive adhesive is designed for automatic dispensing operations. It is the no spacer version of XCP3302 adhesive.
LOCTITE ABLESTIK XE 80100 (Known as HYSOL XE80100) -- 8802596093953 (Known as HYSOL XE80100 ) LOCTITE ABLESTIK XE 80100 is a solventless modified epoxy adhesive that combines low stress with good adhesion on nearly all surfaces and is flexible for...
LOCTITE 315 Output (Known as Loctite 315) -- 8799375163393 (Known as Loctite 315 ) LOCTITE 315 is a self-shimming for electrical isolation; room-temperature curing adhesive.
LOCTITE 3609 (Known as LOCTITE 3609 10ML EFD US) -- 8799552667649 (Known as LOCTITE 3609 10ML EFD US ) LOCTITE 3609 is used for medium to high speed dispense applications. Excellent green strength for large components.
LOCTITE 3612 (Known as Loctite 3612) -- 8802602385409 (Known as Loctite 3612 ) LOCTITE 3612 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium...
LOCTITE 3616 (Known as Loctite 3616) -- 8799374573569 (Known as Loctite 3616 ) LOCTITE 3616 is a high speed stencil print adhesive compatible with DEK Proflow and MPM Rheopump. Ultra low moisture pick-up. Pin transfer capable as well.
LOCTITE 3621 (Known as LOCTITE 3621 30ML EFD US) -- 8799374540801 (Known as LOCTITE 3621 30ML EFD US ) LOCTITE 3621 is a high performance for ultra high-speed syringe dispense. Recommended product for Dispense Jet. Superior humidity resistance and electrical properties.
LOCTITE 3627 (Known as Loctite 3627) -- 8799374180353 (Known as Loctite 3627 ) LOCTITE 3627 is a high speed stencil print adhesive compatible with DEK Proflow and MPM Rheopump. Recommended product for DEK Proflow Pumprint process.
LOCTITE 384 (Known as Loctite 384 Output) -- 8799578554369 (Known as Loctite 384 Output ) LOCTITE 384 is a repairable, room temperature-curing adhesive utilized for parts subject to disassembly.
LOCTITE ABLESTIK ICP CB5424 (Known as Loctite Ablestik ICP CB5424) -- 8802611920897 (Known as Loctite Ablestik ICP CB5424 ) LOCTITE ABLESTIK ICP CB5424 is a one component silicone paste. It is an electrically conductive adhesive. designed for applications where a high degree...
LOCTITE D 125 F DR (Known as LOCTITE D 125F-DR) -- 8799576096769 (Known as LOCTITE D 125F-DR ) LOCTITE D 125 F DR surface mound adhesive is designed for use in high-speed pneumatic and positive displacement dispensers. This one component adhesive is...
Macromelt 6211 (Known as MACROMELT 6211) -- 8802588229633 (Known as MACROMELT 6211 ) Macromelt® 6211™ is a polyamide hot melt adhesive that exhibits excellent low temperature flexibility. This product is suitable for bonding plastics, metal, flexible vinyl, and...
TECHNOMELT PA 687 (Known as Macromelt OM 687) -- 8807299710977 (Known as Macromelt OM 687 ) TECHNOMELT® PA 687™ thermoplastic, hot melt adhesive is designed for molding compound applications.
LOCTITE ABLESTIK 2158 BIPAX (Known as TRA-BOND 2158) -- 8799575179265 (Known as TRA-BOND 2158 ) LOCTITE ABLESTIK 2158 BIPAX is a two part adhesive that develops strong, durable high impact bonds at room temperature which improve heat transfer while maintaining...
LOCTITE ABLESTIK 724-14C (Known as TRA-BOND 724-14C) -- 8799571247105 (Known as TRA-BOND 724-14C ) LOCTITE ABLESTIK 724-14C is designed to provide strong, resilient bonds even in cryogenic conditions. It can also be used for tacking wires and as a...
Loctite 3720 -- 8799578914817 3720 is a single component, UV curable coating resin. This product is specially formulated for moisture protection on terminals of TAB mounts or COG of LCD module. Its high flexibility...
Hysol TRA-BOND FDA16 -- 8802593177601 A medium viscosity epoxy resin paste system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests in vivo and received Class VI...
ABLEBOND 8008NC -- 8802604974081 ABLEBOND 8008NC is a non-conductive snap cure adhesive utilizing wafer backside coating technology.
ABLEBOND AAA3300 -- 8802605006849 ABLEBOND AAA3300 is a self-filleting low modulus adhesive for attaching large die on thin organic substrates.
Ablestik ATB-F100E -- 8802606350337 ABLESTIK ATB-F100E adhesive film is formulated for use in water lamination processes and preform decal. It is designed for use in both mother/daughter die stack packages.
ABLESTIK ICP-3513 -- 8799581405185 ABLESTIK ICP-3513 electrically conductive one component adhesive is designed for use in automated assembly and in-line curing operations.
Ablestik ATB-120US -- 8799555551233 Adhesive film (20 µm) is formulated for use in wafer lamination processess and preform decal. It is designed for use in both mother/daughter die in stack packages.
Ablestik ATB-130US -- 8799555649537 Adhesive film (30 µm) is formulated for use in wafer lamination processess and preform decal. It is designed for use in both mother/daughter die in stack packages.
Ablestik ABLETHERM 3188 -- 8799555158017 Conductive adhesive is designed for thermally enhanced BGA applications. Sensitive to amines. This material needs to be isolated from uncured epoxy-based resins as interaction will inhibit curing. It has a...
Loctite Hysol GR640HV-L1 -- 8799550308353 Delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature. Meets UL 94 V-0 Flammability at 3.175mm thickness. (SOT/SMX)...
ABLESTIK 2025D-SF -- 8799554732033 Designed to continuously flow and form fillets after die placement is complete. The Self-Filleting feature is ideal for packages requiring narrower and more controlled fillets.
ABLESTIK ABLEBOND 2033SC -- 8802605531137 Die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries.
Hysol ECCOBOND CE3103 -- 8802591080449 Eccobond CE3103 is primarily designed for bonding polycarbonate to itself while not inducing stress cracking under typical molded stress levels. Eccobond CE3103 cures rapidly to form flexible, transparent bonds when...
Hysol ECCOBOND DX-20C -- 8802591113217 Eccobond DX-20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be...
Hysol ECCOBOND CE3516LCL -- 8802594750465 Electrically conductive one-component, non-bleeding epoxy adhesive with low outgassing, eliminating wicking and bridging under small components.
Ablestik ATB-105A -- 8799554928641 Excellent pick up performance with PSA D/T and controlled flow for die stacking (5 µm).
Hysol QMI536NB-1A3 -- 8799549423617 High JEDEC performance for first die and die-to-die bonding. Non-conductive and non-damaging to the die face. Can be cured as low as 80°c. No bleed.
Hysol FP4585 -- 8799550046209 High purity, flip-chip underfill, high Pb and no-Pb applications
HYSOL ECCOBOND G500 -- 8799575834625 HYSOL ECCOBOND G500 is a general purpose epoxy adhesive and sealant that cures to a high gloss finish. It is used as insulation of copper and other materials and attaching...
HYSOL ECCOBOND G757HF-D -- 8799575965697 HYSOL ECCOBOND G757HF-D is a low halogen, non-conductive epoxy adhesive for ferrite bonding applications. It is suitable for use with temperature sensitive substrates and components.
Hysol GR828DD -- 8799546572801 Hysol GR828DD is a green, semiconductor grade, low stress and high adhesion molding compound. It is especially designed for DPAK/D2PAK packages with Ni and copper/Ag plating lead frames.
Hysol QMI 536UV -- 8799547457537 Hysol QMI 536UV is used for component or die attach where very high electrical and thermal conductivity is required. Suitable for high heat dissipation devices and solder replacement applications.
HYSOL QMI516IE -- 8799575441409 HYSOL QMI516IE electrically conductive hydrophobic adhesive is designed for die attach applications. It is a snap cure adhesive used in high throughput bonding applications.
Hysol QMI516LC -- 8799540969473 Hysol QMI516LC is a low temperature cure, silver-filled adhesive.
HYSOL UV3001 -- 8799574327297 HYSOL UV3001 is a UV cure adhesive designed for high throughput assembly operations. It can withstand exposure to temperatures as high as 200°C. It is the 4 μm glass rod...
LOCTITE 3131 -- 8799436898305 LOCTITE 3129 is a one-component UV and heat dual cure adhesive for assembly of temperature sensitive electronic components.
LOCTITE 3217 -- 8799553912833 LOCTITE 3217 is a one-component UV and heat dual cure adhesive for assembly of temperature sensitive electronic components.
LOCTITE 3220 -- 8799579013121 LOCTITE 3220 is a one-component low temperature cure, snap cure with excellent ahesion on wide range of materials.
LOCTITE 3508 -- 8802600910849 LOCTITE 3508 is a lead-free, one-component epoxy corner bond adhesive. Applied pre-reflow and allows self-alignment of SMT components during reflow operation. Used for lead-free applications.
LOCTITE 3611 -- 8799375130625 LOCTITE 3611 is a stencil printable/pin transfer product for the bonding of surface mounted devices to printed circuit boards prior to wave soldering.
LOCTITE 3619 -- 8802601435137 LOCTITE 3619 is used for ultra low temperature cure, high speed syringe dispense.
LOCTITE 3629C -- 8799579242497 LOCTITE 3629C is a one-component, halogen free, fast cure epoxy formulated for bonding surface mounted devices to printed circuit boards prior to wave soldering. It is designed to provide controlled...
LOCTITE 3705 -- 8802601598977 LOCTITE 3705 is a UV-cured adhesive designed for bonding electronics components on PCBs. Thixotropic nature reduces migration of product. Excellent adhesion to a wide range of substrate. Bonds in seconds...
LOCTITE 3719 -- 8802601664513 LOCTITE 3719 is a UV light curable adhesive designed for LCD terminal pin bonding applications.
LOCTITE 3736 -- 8802601730049 LOCTITE 3736 is a UV and visible light curable coating resin. This product is specially formulated for moisture protection on COG of LCD module or terminals of TAB mounts. Its...
LOCTITE 383 Output -- 8799553355777 Loctite 383 Output is a thermally conductive adhesive system designed for bonding heat generating components to heat sinks. The high thermal conductivity provides excellent heat dissipation for thermally sensitive components,...
LOCTITE 5404 -- 8799578521601 LOCTITE 5404 Output is a self-shimming, flexible silicone adhesive for demanding parts such as ceramic boards.
LOCTITE 5406M -- 8799579176961 LOCTITE 5406M is a one component flexible RTV silicone engineered to enhance load bearing and shock absorbing properties of the bonded area. It is also used to protect electrical devices...
LOCTITE 5421 -- 8799552176129 LOCTITE 5421 is an RTV silicone that provides EMI / RFI shielding on electronic device enclosures.
LOCTITE ABLELOC 5500SB tape adhesive -- 8802610970625 LOCTITE ABLELOC 5500SB is a tape adhesive for high speed operations where dwell time and pressure must be minimized. The adhesive is coated onto both sides of a polyimide carrier.
LOCTITE ABLESTIK 60L Parts AB carbon filled epoxy adhesive -- 8802611167233 LOCTITE ABLESTIK 60L Parts AB is a two component carbon filled epoxy adhesive with low electrical conductivity designed for general pupose bonding. It is designed for applications where precise resistive...
LOCTITE ABLESTIK ICP 3540 Isotropic conductive paste -- 8802612314113 LOCTITE ABLESTIK ICP 3540 Isotropic conductive paste
LOCTITE ECCOBOND DP 1012UV -- 8802610577409 LOCTITE ECCOBOND DP 1012UV is a one component material designed for use as a wire and tab bond lead encapsulant or damming material. This adhesive cures in seconds when exposed...
LOCTITE ECCOBOND NCP 5208 -- 8802612248577 LOCTITE ECCOBOND NCP 5208 is a non-conductive paste for thermal compression bonding processes in flip chip to laminate assembly. It is designed for advanced flip chip Cu pillar applications. It...
Loctite 3192 -- 8802602418177
Loctite 3195 -- 8802602844161
Loctite 3195DM -- 8802602483713
Loctite 3196 -- 8802602876929
Loctite 5192 -- 8802612379649
Loctite 5192DM -- 8802602942465
Loctite® Liquid Optically Clear Adhesives (LOCAs) for cover lens bonding, touch panel sensor assembly and direct bonding applications in touch panel and display devices including mobile phones, tablets, monitors, televisions...
Hysol ECCOBOND CE3520-3 -- 8799539167233 One component, general conductive, low stress nickel-filled adhesive for mismatched CTE with good shielding properties.
Hysol ECCOBOND G757HF -- 8799549915137 One-component epoxy adhesive providing high mechanical strength; stable contact resistance on Cu and 100% Sn.
Hysol ECCOBOND C990 -- 8799537725441 One-component, silver-filled epoxy adhesive.
Ablestik ABLELUX A4502 -- 8799473565697 Photocurable adhesive is designed for high throughput assembly operations.
Ablestik ABLELUX LA-1UV -- 8799473631233 Single component, photocurable adhesive is designed for bonding camera module assemblies.
ABLESTIK ATB-100 Series (Film) -- 8799479660545 Single layer adhesive film for mother/daughter die stacking applications. Co-curable with molding process.
Ablestik ATB-105U -- 8799473958913 Single layer format, fast cure die attach film (5 µm).
Hysol ECCOBOND CA3152 -- 8799538544641 Snap curable, low temperature cure, electrically conductive adhesive with excellent adhesion and reliability of Cu and Al substrates.
Hysol ECCOBOND D125F -- 8799539724289 Surface mount adhesive designed for high speed dispensing.
Hysol ECCOBOND S-3869 -- 8799474221057 Thermosetting, dielectric adhesive developed for GaN chip bonding for high-brightness LEDs. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE UV8000 -- 8799553978369 UV-curable cationic epoxy adhesive. Designed for use in sealing glass lid of packages of area image sensors such as CCD and CMOS.
XCS80091-2 -- 8802585083905 XCS80091-2 is a one-component, highly flexible conductive adhesive for applications with large CTE mismatches between substrates.