Mill-Max Mfg. Corp. Ball Grid Array Header 587-XX-504-14-005437

  • Ball Grid Array Header - 587-XX-504-14-005437 - Mill-Max Mfg. Corp.
    Mill-Max Mfg. Corp.
Description
Surface Mount .050 Grid; BGA Header
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Ball Grid Array Header - 587-XX-504-14-005437 - Mill-Max Mfg. Corp.
Mill-Max Mfg. Corp.
Oyster Bay, NY, USA
Ball Grid Array Header
587-XX-504-14-005437
Ball Grid Array Header 587-XX-504-14-005437
Surface Mount .050 Grid; BGA Header

Surface Mount .050 Grid; BGA Header

Supplier's Site Datasheet

Technical Specifications

  Mill-Max Mfg. Corp.
Product Category IC Interconnect Components
Product Number 587-XX-504-14-005437
Product Name Ball Grid Array Header
Product Type IC Headers
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Management Lid Capabilities: IC Test Solutions - - Smiths Interconnect
Smiths Interconnect
Thermal Management Lid Capabilities: IC Test Solutions
Specs
Product Type IC Socket
Socket Type Test
View Details
8+2 Pos. Male Cable Housing, Screw-Lok Reverse Fix - G125-32496M3-01-08-01 - Harwin Plc
Harwin Plc
8+2 Pos. Male Cable Housing, Screw-Lok Reverse Fix
G125-32496M3-01-08-01
Specs
RoHS Compliant RoHS Compliant
Current Rating 10 amps
Operating Temperature -65 to 150 C (-85 to 302 F)
View Details
Micro SIM Card PCB Mount Socket - 80440GIH-061T-121L - Rego Electronics Inc.
Rego Electronics Inc.
Micro SIM Card PCB Mount Socket
80440GIH-061T-121L
Specs
Product Type IC Socket
Features Push-Pull
Number of Contacts 6
View Details
PCB Headers & Receptacles - 103911-7 - TE Connectivity
TE Connectivity
PCB Headers & Receptacles
103911-7
Specs
Product Type PCB Receptacles
Mounting Board Mount
Voltage Rating 30 volts
View Details