Hermetic Solutions Group Datasheets for Uncategorized Products

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Product Name Notes
Lead frames reside inside a chip package and are the metal structures that carry signals from the die to the outside. The die inside the package is typically attached to...
Preforms are excellent solution for attaching electronic circuitry and packaging electronic devices. Preforms deliver good thermal and electrical conductivity as well as provide an interface for electronic connections. Alloy selection...
The Hermetic Solutions Group manufactures precious metal evaporation pellets and sputter targets for the thin film coating industry. These products are used to coat dies, components, glass and other electronic...
Used as interconnect pads or bonding islands for gold and aluminum wire bond applications, wire bond tabs are a cost-effective and flexible technology used throughout the microelectronics industry.
When a hermetic package design incorporates ceramic composition or high thermal conductivity material, the Hermetic Solutions Group is your "go to" for ring frames.Ring frames from the Hermetic Solutions Group...
With increasing power, speed and performance demands, dissipating heat in hermetically sealed devices that house sensitive electronic components is one of the biggest challenges in the microelectronics industry. At the...