Xilinx, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XCZU9CG-1FFVB1156E

Description
Manufacturer: AMD Xilinx Win Source Part Number: 1318201-XCZU9CG-1FFV B1156E Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 500MHz, 1.2GHz Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 328 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Supplier Device Package: 1156-FCBGA (35x35) Temperature Range - Operating: 0°C ~ 100°C (TJ) Case / Package: 1156-BBGA, FCBGA ECCN: 5A002A4 XIL Fake Threat In the Open Market: 69 MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.31.0001 Base Product Number: XCZU9 RoHS Status: ROHS3 Compliant
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Description
Manufacturer: AMD Xilinx Win Source Part Number: 1318201-XCZU9CG-1FFV B1156E Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 500MHz, 1.2GHz Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 328 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Supplier Device Package: 1156-FCBGA (35x35) Temperature Range - Operating: 0°C ~ 100°C (TJ) Case / Package: 1156-BBGA, FCBGA ECCN: 5A002A4 XIL Fake Threat In the Open Market: 69 MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.31.0001 Base Product Number: XCZU9 RoHS Status: ROHS3 Compliant
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Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1318201-XCZU9CG-1FFVB1156E - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1318201-XCZU9CG-1FFVB1156E
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1318201-XCZU9CG-1FFVB1156E
Manufacturer: AMD Xilinx Win Source Part Number: 1318201-XCZU9CG-1FFV B1156E Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 500MHz, 1.2GHz Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 328 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Supplier Device Package: 1156-FCBGA (35x35) Temperature Range - Operating: 0°C ~ 100°C (TJ) Case / Package: 1156-BBGA, FCBGA ECCN: 5A002A4 XIL Fake Threat In the Open Market: 69 MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.31.0001 Base Product Number: XCZU9 RoHS Status: ROHS3 Compliant

Manufacturer: AMD Xilinx
Win Source Part Number: 1318201-XCZU9CG-1FFVB1156E
Category: Integrated Circuits (ICs)>Embedded>System On Chip (SoC)
Packaging: Tray
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed: 500MHz, 1.2GHz
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 328
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Supplier Device Package: 1156-FCBGA (35x35)
Temperature Range - Operating: 0°C ~ 100°C (TJ)
Case / Package: 1156-BBGA, FCBGA
ECCN: 5A002A4 XIL
Fake Threat In the Open Market: 69
MSL Level: 4 (72 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.31.0001
Base Product Number: XCZU9
RoHS Status: ROHS3 Compliant

Buy Now Datasheet
System On Chip (SoC) - XCZU9CG-1FFVB1156E-ND - DigiKey
Thief River Falls, MN, United States
System On Chip (SoC)
XCZU9CG-1FFVB1156E-ND
System On Chip (SoC) XCZU9CG-1FFVB1156E-ND
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 500MHz, 1.2GHz 1156-FCBGA (35x35)

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 500MHz, 1.2GHz 1156-FCBGA (35x35)

Buy Now Datasheet
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - XCZU9CG-1FFVB1156E - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
XCZU9CG-1FFVB1156E
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XCZU9CG-1FFVB1156E
IC SOC CORTEX-A53 1156FCBGA

IC SOC CORTEX-A53 1156FCBGA

Supplier's Site

Technical Specifications

  Win Source Electronics DigiKey Shenzhen Shengyu Electronics Technology Limited
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 1318201-XCZU9CG-1FFVB1156E XCZU9CG-1FFVB1156E-ND XCZU9CG-1FFVB1156E
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC) System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Processor Core ARM ARM ARM
RAM Size 0.2560 MB 0.2560 MB 0.2560 MB
Number of Inputs/Outputs 328 # 328 #
Operating Temperature 32 to 212 F (0.0 to 100 C) 32 to 212 F (0.0 to 100 C)
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