Xilinx, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XCZU7EV-3FFVC1156E

Description
Manufacturer: AMD Xilinx Win Source Part Number: 1318178-XCZU7EV-3FFV C1156E Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 600MHz, 1.5GHz Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 360 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Supplier Device Package: 1156-FCBGA (35x35) Temperature Range - Operating: 0°C ~ 100°C (TJ) Case / Package: 1156-BBGA, FCBGA ECCN: 5A002A4 XIL Fake Threat In the Open Market: 78 MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Base Product Number: XCZU7 RoHS Status: ROHS3 Compliant
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Description
Manufacturer: AMD Xilinx Win Source Part Number: 1318178-XCZU7EV-3FFV C1156E Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 600MHz, 1.5GHz Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 360 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Supplier Device Package: 1156-FCBGA (35x35) Temperature Range - Operating: 0°C ~ 100°C (TJ) Case / Package: 1156-BBGA, FCBGA ECCN: 5A002A4 XIL Fake Threat In the Open Market: 78 MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Base Product Number: XCZU7 RoHS Status: ROHS3 Compliant
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Suppliers

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Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1318178-XCZU7EV-3FFVC1156E - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1318178-XCZU7EV-3FFVC1156E
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1318178-XCZU7EV-3FFVC1156E
Manufacturer: AMD Xilinx Win Source Part Number: 1318178-XCZU7EV-3FFV C1156E Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 600MHz, 1.5GHz Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 360 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Supplier Device Package: 1156-FCBGA (35x35) Temperature Range - Operating: 0°C ~ 100°C (TJ) Case / Package: 1156-BBGA, FCBGA ECCN: 5A002A4 XIL Fake Threat In the Open Market: 78 MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Base Product Number: XCZU7 RoHS Status: ROHS3 Compliant

Manufacturer: AMD Xilinx
Win Source Part Number: 1318178-XCZU7EV-3FFVC1156E
Category: Integrated Circuits (ICs)>Embedded>System On Chip (SoC)
Packaging: Tray
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed: 600MHz, 1.5GHz
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 360
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Supplier Device Package: 1156-FCBGA (35x35)
Temperature Range - Operating: 0°C ~ 100°C (TJ)
Case / Package: 1156-BBGA, FCBGA
ECCN: 5A002A4 XIL
Fake Threat In the Open Market: 78
MSL Level: 4 (72 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Base Product Number: XCZU7
RoHS Status: ROHS3 Compliant

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Technical Specifications

  Win Source Electronics
Product Category System on a Chip (SoC)
Product Number 1318178-XCZU7EV-3FFVC1156E
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Processor Core ARM
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