Manufacturer: AMD Xilinx
Win Source Part Number: 1318207-XCZU7EV-3FBV
Category: Integrated Circuits (ICs)>Embedded>Syste
Packaging: Tray
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed: 600MHz, 1.5GHz
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 204
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Supplier Device Package: 900-FCBGA (31x31)
Temperature Range - Operating: 0°C ~ 100°C (TJ)
Case / Package: 900-BBGA, FCBGA
ECCN: 5A002A4 XIL
Fake Threat In the Open Market: 80
MSL Level: 4 (72 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Base Product Number: XCZU7
RoHS Status: ROHS3 Compliant
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EV Zynq®UltraScale+™ FPGA, 504K+ Logic Cells 600MHz, 1.5GHz 900-FCBGA (31x31)
IC SOC CORTEX-A53 900FCBGA
| Win Source Electronics | DigiKey | Shenzhen Shengyu Electronics Technology Limited | |
|---|---|---|---|
| Product Category | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) |
| Product Number | 1318207-XCZU7EV-3FBVB900E | XCZU7EV-3FBVB900E-ND | XCZU7EV-3FBVB900E |
| Product Name | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) | System On Chip (SoC) | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) |
| Processor Core | ARM | ARM | ARM |
| RAM Size | 0.2560 MB | 0.2560 MB | 0.2560 MB |
| Number of Inputs/Outputs | 204 # | 204 # | |
| Operating Temperature | 32 to 212 F (0.0 to 100 C) | 32 to 212 F (0.0 to 100 C) |
