Xilinx, Inc. System On Chip (SoC) XCZU4CG-L2FBVB900E

Description
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 500MHz, 1.2GHz 900-FCBGA (31x31)
Request a Quote Datasheet
Description
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 500MHz, 1.2GHz 900-FCBGA (31x31)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
System On Chip (SoC) - XCZU4CG-L2FBVB900E-ND - DigiKey
Thief River Falls, MN, United States
System On Chip (SoC)
XCZU4CG-L2FBVB900E-ND
System On Chip (SoC) XCZU4CG-L2FBVB900E-ND
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 500MHz, 1.2GHz 900-FCBGA (31x31)

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 500MHz, 1.2GHz 900-FCBGA (31x31)

Buy Now Datasheet
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1318082-XCZU4CG-L2FBVB900E - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1318082-XCZU4CG-L2FBVB900E
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1318082-XCZU4CG-L2FBVB900E
Manufacturer: AMD Xilinx Win Source Part Number: 1318082-XCZU4CG-L2FB VB900E Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 500MHz, 1.2GHz Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 204 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Supplier Device Package: 900-FCBGA (31x31) Temperature Range - Operating: 0°C ~ 100°C (TJ) Case / Package: 900-BBGA, FCBGA ECCN: 5A002A4 XIL Fake Threat In the Open Market: 85 MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Base Product Number: XCZU4 RoHS Status: ROHS3 Compliant

Manufacturer: AMD Xilinx
Win Source Part Number: 1318082-XCZU4CG-L2FBVB900E
Category: Integrated Circuits (ICs)>Embedded>System On Chip (SoC)
Packaging: Tray
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed: 500MHz, 1.2GHz
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 204
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Supplier Device Package: 900-FCBGA (31x31)
Temperature Range - Operating: 0°C ~ 100°C (TJ)
Case / Package: 900-BBGA, FCBGA
ECCN: 5A002A4 XIL
Fake Threat In the Open Market: 85
MSL Level: 4 (72 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Base Product Number: XCZU4
RoHS Status: ROHS3 Compliant

Buy Now Datasheet
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - XCZU4CG-L2FBVB900E - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
XCZU4CG-L2FBVB900E
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XCZU4CG-L2FBVB900E
IC SOC CORTEX-A53 900FCBGA

IC SOC CORTEX-A53 900FCBGA

Supplier's Site

Technical Specifications

  DigiKey Win Source Electronics Shenzhen Shengyu Electronics Technology Limited
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number XCZU4CG-L2FBVB900E-ND 1318082-XCZU4CG-L2FBVB900E XCZU4CG-L2FBVB900E
Product Name System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Processor Core ARM ARM ARM
Interface CAN; SPI; UART; USB
Package / Case 900-BBGA, FCBGA
Clock Frequency 500 to 1200 MHz 500 to 1200 MHz
Unlock Full Specs
to access all available technical data

Similar Products

Specs
Processor Core ARM
Clock Frequency 1200 MHz
Operating Temperature -40 to 212 F (-40 to 100 C)
View Details
MOTIX™ | Embedded Power ICs (System-on-Chip), Relay Driver IC with Integrated Arm® Cortex® M0 - TLE9844-2QX - Infineon Technologies AG
Specs
Processor Core ARM
Interface LIN
Package / Case PG-VQFN-48
View Details