Xilinx, Inc. Embedded - Embedded - System On Chip (SoC) - XCZU15EG-2FFVB1156I XCZU15EG-2FFVB1156I

Description
Manufacturer: Xilinx Inc. Win Source Part Number: 813011-XCZU15EG-2FFV B1156I Packaging: Tray Core Processor: Quad ARM Cortex -A53 MPCore with CoreSight , Dual ARM Cortex -R5 with CoreSight , ARM Mali -400 MP2 Speed: 533MHz, 600MHz, 1.3GHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 328 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq UltraScale+ FPGA, 747K+ Logic Cells Supplier Device Package: 1156-FCBGA (35x35) Temperature Range - Operating: -40°C ~ 100°C Manufacturer Package: 1156-BBGA, FCBGA Popularity: Low Fake Threat In the Open Market: 80 pct. Supply and Demand Status: Limited Manufacturer Pack Quantity: 1 MSL Level: 4 (72 Hours)
Request a Quote Datasheet
Description
Manufacturer: Xilinx Inc. Win Source Part Number: 813011-XCZU15EG-2FFV B1156I Packaging: Tray Core Processor: Quad ARM Cortex -A53 MPCore with CoreSight , Dual ARM Cortex -R5 with CoreSight , ARM Mali -400 MP2 Speed: 533MHz, 600MHz, 1.3GHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 328 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq UltraScale+ FPGA, 747K+ Logic Cells Supplier Device Package: 1156-FCBGA (35x35) Temperature Range - Operating: -40°C ~ 100°C Manufacturer Package: 1156-BBGA, FCBGA Popularity: Low Fake Threat In the Open Market: 80 pct. Supply and Demand Status: Limited Manufacturer Pack Quantity: 1 MSL Level: 4 (72 Hours)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Embedded - Embedded - System On Chip (SoC) - XCZU15EG-2FFVB1156I - 813011-XCZU15EG-2FFVB1156I - Win Source Electronics
Laguna Hills, CA, United States
Embedded - Embedded - System On Chip (SoC) - XCZU15EG-2FFVB1156I
813011-XCZU15EG-2FFVB1156I
Embedded - Embedded - System On Chip (SoC) - XCZU15EG-2FFVB1156I 813011-XCZU15EG-2FFVB1156I
Manufacturer: Xilinx Inc. Win Source Part Number: 813011-XCZU15EG-2FFV B1156I Packaging: Tray Core Processor: Quad ARM Cortex -A53 MPCore with CoreSight , Dual ARM Cortex -R5 with CoreSight , ARM Mali -400 MP2 Speed: 533MHz, 600MHz, 1.3GHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 328 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq UltraScale+ FPGA, 747K+ Logic Cells Supplier Device Package: 1156-FCBGA (35x35) Temperature Range - Operating: -40°C ~ 100°C Manufacturer Package: 1156-BBGA, FCBGA Popularity: Low Fake Threat In the Open Market: 80 pct. Supply and Demand Status: Limited Manufacturer Pack Quantity: 1 MSL Level: 4 (72 Hours)

Manufacturer: Xilinx Inc.
Win Source Part Number: 813011-XCZU15EG-2FFVB1156I
Packaging: Tray
Core Processor: Quad ARM Cortex -A53 MPCore with CoreSight , Dual ARM Cortex -R5 with CoreSight , ARM Mali -400 MP2
Speed: 533MHz, 600MHz, 1.3GHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 328
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Zynq UltraScale+ FPGA, 747K+ Logic Cells
Supplier Device Package: 1156-FCBGA (35x35)
Temperature Range - Operating: -40°C ~ 100°C
Manufacturer Package: 1156-BBGA, FCBGA
Popularity: Low
Fake Threat In the Open Market: 80 pct.
Supply and Demand Status: Limited
Manufacturer Pack Quantity: 1
MSL Level: 4 (72 Hours)

Buy Now Datasheet
System On Chip (SoC) - XCZU15EG-2FFVB1156I-ND - DigiKey
Thief River Falls, MN, United States
System On Chip (SoC)
XCZU15EG-2FFVB1156I-ND
System On Chip (SoC) XCZU15EG-2FFVB1156I-ND
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 747K+ Logic Cells 533MHz, 600MHz, 1.3GHz 1156-FCBGA (35x35)

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 747K+ Logic Cells 533MHz, 600MHz, 1.3GHz 1156-FCBGA (35x35)

Buy Now Datasheet
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - XCZU15EG-2FFVB1156I - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
XCZU15EG-2FFVB1156I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XCZU15EG-2FFVB1156I
IC SOC CORTEX-A53 1156FCBGA

IC SOC CORTEX-A53 1156FCBGA

Supplier's Site

Technical Specifications

  Win Source Electronics DigiKey Shenzhen Shengyu Electronics Technology Limited
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 813011-XCZU15EG-2FFVB1156I XCZU15EG-2FFVB1156I-ND XCZU15EG-2FFVB1156I
Product Name Embedded - Embedded - System On Chip (SoC) - XCZU15EG-2FFVB1156I System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Processor Core ARM ARM ARM
RAM Size 0.2560 MB 0.2560 MB 0.2560 MB
Number of Inputs/Outputs 328 # 328 #
Operating Temperature -40 to 212 F (-40 to 100 C) -40 to 212 F (-40 to 100 C)
Unlock Full Specs
to access all available technical data

Similar Products