Manufacturer: AMD Xilinx
Win Source Part Number: 1318039-XC7Z100-L2FF
Category: Integrated Circuits (ICs)>Embedded>Syste
Packaging: Tray
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 800MHz
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 130
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells
Supplier Device Package: 1156-FCBGA (35x35)
Temperature Range - Operating: -40°C ~ 100°C (TJ)
Case / Package: 1156-BBGA, FCBGA
ECCN: 3A991D
Fake Threat In the Open Market: 65
MSL Level: 4 (72 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Base Product Number: XC7Z100
RoHS Status: ROHS3 Compliant
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 444K Logic Cells 800MHz 1156-FCBGA (35x35)
| Win Source Electronics | DigiKey | |
|---|---|---|
| Product Category | System on a Chip (SoC) | System on a Chip (SoC) |
| Product Number | 1318039-XC7Z100-L2FFG1156I | XC7Z100-L2FFG1156I-ND |
| Product Name | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) | System On Chip (SoC) |
| Processor Core | ARM | ARM |
| RAM Size | 0.2560 MB | 0.2560 MB |
| Number of Inputs/Outputs | 130 # | 130 # |
| Operating Temperature | -40 to 212 F (-40 to 100 C) | -40 to 212 F (-40 to 100 C) |
