Xilinx, Inc. System On Chip (SoC) XC7Z100-L2FFG1156I

Description
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 444K Logic Cells 800MHz 1156-FCBGA (35x35)
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Description
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 444K Logic Cells 800MHz 1156-FCBGA (35x35)
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Suppliers

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System On Chip (SoC) - XC7Z100-L2FFG1156I-ND - DigiKey
Thief River Falls, MN, United States
System On Chip (SoC)
XC7Z100-L2FFG1156I-ND
System On Chip (SoC) XC7Z100-L2FFG1156I-ND
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 444K Logic Cells 800MHz 1156-FCBGA (35x35)

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 444K Logic Cells 800MHz 1156-FCBGA (35x35)

Buy Now Datasheet
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1318039-XC7Z100-L2FFG1156I - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1318039-XC7Z100-L2FFG1156I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1318039-XC7Z100-L2FFG1156I
Manufacturer: AMD Xilinx Win Source Part Number: 1318039-XC7Z100-L2FF G1156I Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 800MHz Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells Supplier Device Package: 1156-FCBGA (35x35) Temperature Range - Operating: -40°C ~ 100°C (TJ) Case / Package: 1156-BBGA, FCBGA ECCN: 3A991D Fake Threat In the Open Market: 65 MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Base Product Number: XC7Z100 RoHS Status: ROHS3 Compliant

Manufacturer: AMD Xilinx
Win Source Part Number: 1318039-XC7Z100-L2FFG1156I
Category: Integrated Circuits (ICs)>Embedded>System On Chip (SoC)
Packaging: Tray
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 800MHz
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 130
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells
Supplier Device Package: 1156-FCBGA (35x35)
Temperature Range - Operating: -40°C ~ 100°C (TJ)
Case / Package: 1156-BBGA, FCBGA
ECCN: 3A991D
Fake Threat In the Open Market: 65
MSL Level: 4 (72 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Base Product Number: XC7Z100
RoHS Status: ROHS3 Compliant

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Technical Specifications

  DigiKey Win Source Electronics
Product Category System on a Chip (SoC) System on a Chip (SoC)
Product Number XC7Z100-L2FFG1156I-ND 1318039-XC7Z100-L2FFG1156I
Product Name System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Processor Core ARM ARM
Interface CAN; SPI; UART; USB
Package / Case 1156-BBGA, FCBGA
Clock Frequency 800 MHz
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