Xilinx, Inc. Embedded - Embedded - System On Chip (SoC) - XC7Z100-2FFG1156I XC7Z100-2FFG1156I

Description
Manufacturer: Xilinx Inc. Win Source Part Number: 799982-XC7Z100-2FFG1 156I Series: Zynq-7000 Packaging: Tray Operating Temperature Range: -40°C ~ 100°C (TJ) Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight Speed: 800MHz Package: 1156-BBGA, FCBGA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 250 Architecture: MCU, FPGA MCU RAM: 256KB Primary Attributes: Kintex-7 FPGA, 444K Logic Cells Family Name: XC7Z100 Categories: Integrated Circuits (ICs) Manufacturer Package: 1156-FCBGA (35x35) ECCN: 3A991.d Estimated EOL Date: 2026 Popularity: Medium Fake Threat In the Open Market: 55 pct. Supply and Demand Status: Limited
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Description
Manufacturer: Xilinx Inc. Win Source Part Number: 799982-XC7Z100-2FFG1 156I Series: Zynq-7000 Packaging: Tray Operating Temperature Range: -40°C ~ 100°C (TJ) Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight Speed: 800MHz Package: 1156-BBGA, FCBGA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 250 Architecture: MCU, FPGA MCU RAM: 256KB Primary Attributes: Kintex-7 FPGA, 444K Logic Cells Family Name: XC7Z100 Categories: Integrated Circuits (ICs) Manufacturer Package: 1156-FCBGA (35x35) ECCN: 3A991.d Estimated EOL Date: 2026 Popularity: Medium Fake Threat In the Open Market: 55 pct. Supply and Demand Status: Limited
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Embedded - Embedded - System On Chip (SoC) - XC7Z100-2FFG1156I - 799982-XC7Z100-2FFG1156I - Win Source Electronics
Laguna Hills, CA, United States
Embedded - Embedded - System On Chip (SoC) - XC7Z100-2FFG1156I
799982-XC7Z100-2FFG1156I
Embedded - Embedded - System On Chip (SoC) - XC7Z100-2FFG1156I 799982-XC7Z100-2FFG1156I
Manufacturer: Xilinx Inc. Win Source Part Number: 799982-XC7Z100-2FFG1 156I Series: Zynq-7000 Packaging: Tray Operating Temperature Range: -40°C ~ 100°C (TJ) Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight Speed: 800MHz Package: 1156-BBGA, FCBGA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 250 Architecture: MCU, FPGA MCU RAM: 256KB Primary Attributes: Kintex-7 FPGA, 444K Logic Cells Family Name: XC7Z100 Categories: Integrated Circuits (ICs) Manufacturer Package: 1156-FCBGA (35x35) ECCN: 3A991.d Estimated EOL Date: 2026 Popularity: Medium Fake Threat In the Open Market: 55 pct. Supply and Demand Status: Limited

Manufacturer: Xilinx Inc.
Win Source Part Number: 799982-XC7Z100-2FFG1156I
Series: Zynq-7000
Packaging: Tray
Operating Temperature Range: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight
Speed: 800MHz
Package: 1156-BBGA, FCBGA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 250
Architecture: MCU, FPGA
MCU RAM: 256KB
Primary Attributes: Kintex-7 FPGA, 444K Logic Cells
Family Name: XC7Z100
Categories: Integrated Circuits (ICs)
Manufacturer Package: 1156-FCBGA (35x35)
ECCN: 3A991.d
Estimated EOL Date: 2026
Popularity: Medium
Fake Threat In the Open Market: 55 pct.
Supply and Demand Status: Limited

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Technical Specifications

  Win Source Electronics
Product Category Programmable Logic Devices (PLD)
Product Number 799982-XC7Z100-2FFG1156I
Product Name Embedded - Embedded - System On Chip (SoC) - XC7Z100-2FFG1156I
Operating Temperature -40 to 100 C (-40 to 212 F)
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