Xilinx, Inc. Embedded - Embedded - System On Chip (SoC) - XC7Z045-2FFG676E XC7Z045-2FFG676E

Description
Manufacturer: Xilinx Inc. Win Source Part Number: 852972-XC7Z045-2FFG6 76E Series: Zynq®-7000 Operating Temperature Range: 0°C ~ 100°C (TJ) Features: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Kintex™-7 FPGA, 350K Logic Cells 800MHz 676-FCBGA (27x27) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 800MHz Package: Tray Package: 676-BBGA, FCBGA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 Family Name: XC7Z045 Categories: Integrated Circuits (ICs) Case / Package: 676-FCBGA (27x27) ECCN: 3A991D Popularity: Medium Fake Threat In the Open Market: 58 pct. Supply and Demand Status: Limited Quantity per package: 1 MSL Level: 4 (72 Hours) Estimated Pruduction Lead Time: 51 Weeks REACH Status: REACH Unaffected HTSUS: 8542.39.0001
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Description
Manufacturer: Xilinx Inc. Win Source Part Number: 852972-XC7Z045-2FFG6 76E Series: Zynq®-7000 Operating Temperature Range: 0°C ~ 100°C (TJ) Features: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Kintex™-7 FPGA, 350K Logic Cells 800MHz 676-FCBGA (27x27) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 800MHz Package: Tray Package: 676-BBGA, FCBGA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 Family Name: XC7Z045 Categories: Integrated Circuits (ICs) Case / Package: 676-FCBGA (27x27) ECCN: 3A991D Popularity: Medium Fake Threat In the Open Market: 58 pct. Supply and Demand Status: Limited Quantity per package: 1 MSL Level: 4 (72 Hours) Estimated Pruduction Lead Time: 51 Weeks REACH Status: REACH Unaffected HTSUS: 8542.39.0001
Request a Quote Datasheet

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Laguna Hills, CA, United States
Embedded - Embedded - System On Chip (SoC) - XC7Z045-2FFG676E
852972-XC7Z045-2FFG676E
Embedded - Embedded - System On Chip (SoC) - XC7Z045-2FFG676E 852972-XC7Z045-2FFG676E
Manufacturer: Xilinx Inc. Win Source Part Number: 852972-XC7Z045-2FFG6 76E Series: Zynq®-7000 Operating Temperature Range: 0°C ~ 100°C (TJ) Features: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Kintex™-7 FPGA, 350K Logic Cells 800MHz 676-FCBGA (27x27) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 800MHz Package: Tray Package: 676-BBGA, FCBGA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 Family Name: XC7Z045 Categories: Integrated Circuits (ICs) Case / Package: 676-FCBGA (27x27) ECCN: 3A991D Popularity: Medium Fake Threat In the Open Market: 58 pct. Supply and Demand Status: Limited Quantity per package: 1 MSL Level: 4 (72 Hours) Estimated Pruduction Lead Time: 51 Weeks REACH Status: REACH Unaffected HTSUS: 8542.39.0001

Manufacturer: Xilinx Inc.
Win Source Part Number: 852972-XC7Z045-2FFG676E
Series: Zynq®-7000
Operating Temperature Range: 0°C ~ 100°C (TJ)
Features: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Kintex™-7 FPGA, 350K Logic Cells 800MHz 676-FCBGA (27x27)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 800MHz
Package: Tray
Package: 676-BBGA, FCBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 130
Family Name: XC7Z045
Categories: Integrated Circuits (ICs)
Case / Package: 676-FCBGA (27x27)
ECCN: 3A991D
Popularity: Medium
Fake Threat In the Open Market: 58 pct.
Supply and Demand Status: Limited
Quantity per package: 1
MSL Level: 4 (72 Hours)
Estimated Pruduction Lead Time: 51 Weeks
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001

Buy Now Datasheet
System On Chip (SoC) - XC7Z045-2FFG676E-ND - DigiKey
Thief River Falls, MN, United States
System On Chip (SoC)
XC7Z045-2FFG676E-ND
System On Chip (SoC) XC7Z045-2FFG676E-ND
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 350K Logic Cells 800MHz 676-FCBGA (27x27)

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 350K Logic Cells 800MHz 676-FCBGA (27x27)

Buy Now Datasheet
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - XC7Z045-2FFG676E - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
XC7Z045-2FFG676E
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XC7Z045-2FFG676E
IC SOC CORTEX-A9 800MHZ 676FCBGA

IC SOC CORTEX-A9 800MHZ 676FCBGA

Supplier's Site

Technical Specifications

  Win Source Electronics DigiKey Shenzhen Shengyu Electronics Technology Limited
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 852972-XC7Z045-2FFG676E XC7Z045-2FFG676E-ND XC7Z045-2FFG676E
Product Name Embedded - Embedded - System On Chip (SoC) - XC7Z045-2FFG676E System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Processor Core ARM ARM ARM
Package / Case 676-BBGA, FCBGA 676-BBGA, FCBGA
Number of Inputs/Outputs 130 # 130 #
Operating Temperature 32 to 212 F (0.0 to 100 C) 32 to 212 F (0.0 to 100 C)
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