Xilinx, Inc. System On Chip (SoC) XC7Z035-2FBG676I

Description
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 275K Logic Cells 800MHz 676-FCBGA (27x27)
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Description
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 275K Logic Cells 800MHz 676-FCBGA (27x27)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
System On Chip (SoC) - XC7Z035-2FBG676I-ND - DigiKey
Thief River Falls, MN, United States
System On Chip (SoC)
XC7Z035-2FBG676I-ND
System On Chip (SoC) XC7Z035-2FBG676I-ND
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 275K Logic Cells 800MHz 676-FCBGA (27x27)

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 275K Logic Cells 800MHz 676-FCBGA (27x27)

Buy Now Datasheet
Embedded - Embedded - System On Chip (SoC) - XC7Z035-2FBG676I - 812454-XC7Z035-2FBG676I - Win Source Electronics
Laguna Hills, CA, United States
Embedded - Embedded - System On Chip (SoC) - XC7Z035-2FBG676I
812454-XC7Z035-2FBG676I
Embedded - Embedded - System On Chip (SoC) - XC7Z035-2FBG676I 812454-XC7Z035-2FBG676I
Manufacturer: Xilinx Inc. Win Source Part Number: 812454-XC7Z035-2FBG6 76I Packaging: Tray Core Processor: Dual ARM Cortex -A9 MPCore with CoreSight Speed: 800MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Kintex -7 FPGA, 275K Logic Cells Supplier Device Package: 676-FCBGA (27x27) Temperature Range - Operating: -40°C ~ 100°C Manufacturer Package: 676-BBGA, FCBGA Popularity: Low Fake Threat In the Open Market: 63 pct. Supply and Demand Status: Limited Manufacturer Pack Quantity: 1 MSL Level: 4 (72 Hours)

Manufacturer: Xilinx Inc.
Win Source Part Number: 812454-XC7Z035-2FBG676I
Packaging: Tray
Core Processor: Dual ARM Cortex -A9 MPCore with CoreSight
Speed: 800MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 130
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Kintex -7 FPGA, 275K Logic Cells
Supplier Device Package: 676-FCBGA (27x27)
Temperature Range - Operating: -40°C ~ 100°C
Manufacturer Package: 676-BBGA, FCBGA
Popularity: Low
Fake Threat In the Open Market: 63 pct.
Supply and Demand Status: Limited
Manufacturer Pack Quantity: 1
MSL Level: 4 (72 Hours)

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Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - XC7Z035-2FBG676I - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
XC7Z035-2FBG676I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XC7Z035-2FBG676I
IC SOC CORTEX-A9 800MHZ 676FCBGA

IC SOC CORTEX-A9 800MHZ 676FCBGA

Supplier's Site

Technical Specifications

  DigiKey Win Source Electronics Shenzhen Shengyu Electronics Technology Limited
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number XC7Z035-2FBG676I-ND 812454-XC7Z035-2FBG676I XC7Z035-2FBG676I
Product Name System On Chip (SoC) Embedded - Embedded - System On Chip (SoC) - XC7Z035-2FBG676I Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Processor Core ARM ARM ARM
Interface CAN; SPI; UART; USB
Package / Case 676-BBGA, FCBGA
Clock Frequency 800 MHz 800 MHz
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