Manufacturer: Xilinx Inc.
Win Source Part Number: 812454-XC7Z035-2FBG6
Packaging: Tray
Core Processor: Dual ARM Cortex -A9 MPCore with CoreSight
Speed: 800MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 130
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Kintex -7 FPGA, 275K Logic Cells
Supplier Device Package: 676-FCBGA (27x27)
Temperature Range - Operating: -40°C ~ 100°C
Manufacturer Package: 676-BBGA, FCBGA
Popularity: Low
Fake Threat In the Open Market: 63 pct.
Supply and Demand Status: Limited
Manufacturer Pack Quantity: 1
MSL Level: 4 (72 Hours)
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 275K Logic Cells 800MHz 676-FCBGA (27x27)
IC SOC CORTEX-A9 800MHZ 676FCBGA
| Win Source Electronics | DigiKey | Shenzhen Shengyu Electronics Technology Limited | |
|---|---|---|---|
| Product Category | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) |
| Product Number | 812454-XC7Z035-2FBG676I | XC7Z035-2FBG676I-ND | XC7Z035-2FBG676I |
| Product Name | Embedded - Embedded - System On Chip (SoC) - XC7Z035-2FBG676I | System On Chip (SoC) | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) |
| Processor Core | ARM | ARM | ARM |
| RAM Size | 0.2560 MB | 0.2560 MB | 0.2560 MB |
| Number of Inputs/Outputs | 130 # | 130 # | |
| Operating Temperature | -40 to 212 F (-40 to 100 C) | -40 to 212 F (-40 to 100 C) |
