Xilinx, Inc. Embedded - Embedded - System On Chip (SoC) - XC7Z035-1FBG676I XC7Z035-1FBG676I

Description
Manufacturer: Xilinx Inc. Win Source Part Number: 750792-XC7Z035-1FBG6 76I Series: Zynq-7000 Packaging: Tray Operating Temperature Range: -40°C ~ 100°C (TJ) Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight Speed: 667MHz Package: 676-BBGA, FCBGA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 Architecture: MCU, FPGA MCU RAM: 256KB Primary Attributes: Kintex-7 FPGA, 275K Logic Cells Family Name: XC7Z035 Categories: Integrated Circuits (ICs) Manufacturer Package: 676-FCBGA (27x27) Alternative Parts (Cross-Reference): XC7Z035-1FBG676C; Introduction Date: July 28, 2016 ECCN: 3A991.d Country of Origin: Taiwan Estimated EOL Date: 2027 Popularity: Medium Fake Threat In the Open Market: 68 pct. Supply and Demand Status: Limited
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Description
Manufacturer: Xilinx Inc. Win Source Part Number: 750792-XC7Z035-1FBG6 76I Series: Zynq-7000 Packaging: Tray Operating Temperature Range: -40°C ~ 100°C (TJ) Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight Speed: 667MHz Package: 676-BBGA, FCBGA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 Architecture: MCU, FPGA MCU RAM: 256KB Primary Attributes: Kintex-7 FPGA, 275K Logic Cells Family Name: XC7Z035 Categories: Integrated Circuits (ICs) Manufacturer Package: 676-FCBGA (27x27) Alternative Parts (Cross-Reference): XC7Z035-1FBG676C; Introduction Date: July 28, 2016 ECCN: 3A991.d Country of Origin: Taiwan Estimated EOL Date: 2027 Popularity: Medium Fake Threat In the Open Market: 68 pct. Supply and Demand Status: Limited
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Laguna Hills, CA, United States
Embedded - Embedded - System On Chip (SoC) - XC7Z035-1FBG676I
750792-XC7Z035-1FBG676I
Embedded - Embedded - System On Chip (SoC) - XC7Z035-1FBG676I 750792-XC7Z035-1FBG676I
Manufacturer: Xilinx Inc. Win Source Part Number: 750792-XC7Z035-1FBG6 76I Series: Zynq-7000 Packaging: Tray Operating Temperature Range: -40°C ~ 100°C (TJ) Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight Speed: 667MHz Package: 676-BBGA, FCBGA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 Architecture: MCU, FPGA MCU RAM: 256KB Primary Attributes: Kintex-7 FPGA, 275K Logic Cells Family Name: XC7Z035 Categories: Integrated Circuits (ICs) Manufacturer Package: 676-FCBGA (27x27) Alternative Parts (Cross-Reference): XC7Z035-1FBG676C; Introduction Date: July 28, 2016 ECCN: 3A991.d Country of Origin: Taiwan Estimated EOL Date: 2027 Popularity: Medium Fake Threat In the Open Market: 68 pct. Supply and Demand Status: Limited

Manufacturer: Xilinx Inc.
Win Source Part Number: 750792-XC7Z035-1FBG676I
Series: Zynq-7000
Packaging: Tray
Operating Temperature Range: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight
Speed: 667MHz
Package: 676-BBGA, FCBGA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 130
Architecture: MCU, FPGA
MCU RAM: 256KB
Primary Attributes: Kintex-7 FPGA, 275K Logic Cells
Family Name: XC7Z035
Categories: Integrated Circuits (ICs)
Manufacturer Package: 676-FCBGA (27x27)
Alternative Parts (Cross-Reference): XC7Z035-1FBG676C;
Introduction Date: July 28, 2016
ECCN: 3A991.d
Country of Origin: Taiwan
Estimated EOL Date: 2027
Popularity: Medium
Fake Threat In the Open Market: 68 pct.
Supply and Demand Status: Limited

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System On Chip (SoC) - XC7Z035-1FBG676I-ND - DigiKey
Thief River Falls, MN, United States
System On Chip (SoC)
XC7Z035-1FBG676I-ND
System On Chip (SoC) XC7Z035-1FBG676I-ND
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 275K Logic Cells 667MHz 676-FCBGA (27x27)

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 275K Logic Cells 667MHz 676-FCBGA (27x27)

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Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - XC7Z035-1FBG676I - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
XC7Z035-1FBG676I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XC7Z035-1FBG676I
IC SOC CORTEX-A9 667MHZ 676FCBGA

IC SOC CORTEX-A9 667MHZ 676FCBGA

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Technical Specifications

  Win Source Electronics DigiKey Shenzhen Shengyu Electronics Technology Limited
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 750792-XC7Z035-1FBG676I XC7Z035-1FBG676I-ND XC7Z035-1FBG676I
Product Name Embedded - Embedded - System On Chip (SoC) - XC7Z035-1FBG676I System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Processor Core ARM ARM ARM
Package / Case 676-BBGA, FCBGA 676-BBGA, FCBGA
RAM Size 0.2560 MB 0.2560 MB 0.2560 MB
Number of Inputs/Outputs 130 # 130 #
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