Xilinx, Inc. Embedded - Embedded - System On Chip (SoC) - XC7Z030-2FBG676I XC7Z030-2FBG676I

Description
Manufacturer: Xilinx Inc. Win Source Part Number: 844131-XC7Z030-2FBG6 76I Series: Zynq®-7000 Operating Temperature Range: -40°C ~ 100°C (TJ) Features: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Kintex™-7 FPGA, 125K Logic Cells 800MHz 676-FCBGA (27x27) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 800MHz Package: Tray Package: 676-BBGA, FCBGA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 Family Name: XC7Z030 Categories: Integrated Circuits (ICs) Case / Package: 676-FCBGA (27x27) ECCN: 3A991D Popularity: Medium Fake Threat In the Open Market: 52 pct. Supply and Demand Status: Limited Quantity per package: 1 MSL Level: 4 (72 Hours) Estimated Pruduction Lead Time: 51 Weeks REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Other Part Number: 122-2020, XC7Z030-2FBG676I-ND
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Description
Manufacturer: Xilinx Inc. Win Source Part Number: 844131-XC7Z030-2FBG6 76I Series: Zynq®-7000 Operating Temperature Range: -40°C ~ 100°C (TJ) Features: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Kintex™-7 FPGA, 125K Logic Cells 800MHz 676-FCBGA (27x27) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 800MHz Package: Tray Package: 676-BBGA, FCBGA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 Family Name: XC7Z030 Categories: Integrated Circuits (ICs) Case / Package: 676-FCBGA (27x27) ECCN: 3A991D Popularity: Medium Fake Threat In the Open Market: 52 pct. Supply and Demand Status: Limited Quantity per package: 1 MSL Level: 4 (72 Hours) Estimated Pruduction Lead Time: 51 Weeks REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Other Part Number: 122-2020, XC7Z030-2FBG676I-ND
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Laguna Hills, CA, United States
Embedded - Embedded - System On Chip (SoC) - XC7Z030-2FBG676I
844131-XC7Z030-2FBG676I
Embedded - Embedded - System On Chip (SoC) - XC7Z030-2FBG676I 844131-XC7Z030-2FBG676I
Manufacturer: Xilinx Inc. Win Source Part Number: 844131-XC7Z030-2FBG6 76I Series: Zynq®-7000 Operating Temperature Range: -40°C ~ 100°C (TJ) Features: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Kintex™-7 FPGA, 125K Logic Cells 800MHz 676-FCBGA (27x27) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 800MHz Package: Tray Package: 676-BBGA, FCBGA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 Family Name: XC7Z030 Categories: Integrated Circuits (ICs) Case / Package: 676-FCBGA (27x27) ECCN: 3A991D Popularity: Medium Fake Threat In the Open Market: 52 pct. Supply and Demand Status: Limited Quantity per package: 1 MSL Level: 4 (72 Hours) Estimated Pruduction Lead Time: 51 Weeks REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Other Part Number: 122-2020, XC7Z030-2FBG676I-ND

Manufacturer: Xilinx Inc.
Win Source Part Number: 844131-XC7Z030-2FBG676I
Series: Zynq®-7000
Operating Temperature Range: -40°C ~ 100°C (TJ)
Features: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Kintex™-7 FPGA, 125K Logic Cells 800MHz 676-FCBGA (27x27)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 800MHz
Package: Tray
Package: 676-BBGA, FCBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 130
Family Name: XC7Z030
Categories: Integrated Circuits (ICs)
Case / Package: 676-FCBGA (27x27)
ECCN: 3A991D
Popularity: Medium
Fake Threat In the Open Market: 52 pct.
Supply and Demand Status: Limited
Quantity per package: 1
MSL Level: 4 (72 Hours)
Estimated Pruduction Lead Time: 51 Weeks
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Other Part Number: 122-2020, XC7Z030-2FBG676I-ND

Buy Now Datasheet
System On Chip (SoC) - 122-2020-ND - DigiKey
Thief River Falls, MN, United States
System On Chip (SoC)
122-2020-ND
System On Chip (SoC) 122-2020-ND
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells 800MHz 676-FCBGA (27x27)

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells 800MHz 676-FCBGA (27x27)

Buy Now Datasheet
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - XC7Z030-2FBG676I - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
XC7Z030-2FBG676I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XC7Z030-2FBG676I
IC SOC CORTEX-A9 800MHZ 676FCBGA

IC SOC CORTEX-A9 800MHZ 676FCBGA

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Technical Specifications

  Win Source Electronics DigiKey Shenzhen Shengyu Electronics Technology Limited
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 844131-XC7Z030-2FBG676I 122-2020-ND XC7Z030-2FBG676I
Product Name Embedded - Embedded - System On Chip (SoC) - XC7Z030-2FBG676I System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Processor Core ARM ARM ARM
Package / Case 676-BBGA, FCBGA 676-BBGA, FCBGA
Number of Inputs/Outputs 130 # 130 #
Operating Temperature -40 to 212 F (-40 to 100 C) -40 to 212 F (-40 to 100 C)
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