Manufacturer: Xilinx Inc.
Win Source Part Number: 810860-XC7Z030-1FBG6
Packaging: Tray
Core Processor: Dual ARM Cortex -A9 MPCore with CoreSight
Speed: 667MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 130
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Kintex -7 FPGA, 125K Logic Cells
Supplier Device Package: 676-FCBGA (27x27)
Temperature Range - Operating: 0°C ~ 85°C
Manufacturer Package: 676-BBGA, FCBGA
Popularity: Medium
Fake Threat In the Open Market: 59 pct.
Supply and Demand Status: Limited
Manufacturer Pack Quantity: 1
MSL Level: 4 (72 Hours)
Part Number Series: XC7Z030
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells 667MHz 676-FCBGA (27x27)
IC SOC CORTEX-A9 667MHZ 676FCBGA
| Win Source Electronics | DigiKey | Shenzhen Shengyu Electronics Technology Limited | |
|---|---|---|---|
| Product Category | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) |
| Product Number | 810860-XC7Z030-1FBG676C | 122-1892-ND | XC7Z030-1FBG676C |
| Product Name | Embedded - Embedded - System On Chip (SoC) - XC7Z030-1FBG676C | System On Chip (SoC) | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) |
| Processor Core | ARM | ARM | ARM |
| RAM Size | 0.2560 MB | 0.2560 MB | 0.2560 MB |
| Number of Inputs/Outputs | 130 # | 130 # | |
| Operating Temperature | 32 to 185 F (0.0 to 85 C) | 32 to 185 F (0.0 to 85 C) |
