Xilinx, Inc. Embedded - Embedded - FPGAs (Field Programmable Gate Array) - XC2S50E-6FTG256C XC2S50E-6FTG256C

Description
Manufacturer: Xilinx Inc. Win Source Part Number: 214082-XC2S50E-6FTG2 56C Mounting: SMD (SMT) Number of I/O: 182 Number of LABs/CLBs: 384 Number of Logic Elements/Cells: 1728 Total RAM Bits: 32768 Number of Gates: 50000 Family Name: XC2S50E Categories: Integrated Circuits Status: Obsolete(EOL) Temperature Range - Operating: 0°C to 85°C (TJ) Case / Package: 256-FTBGA (17x17) Supply Voltage - Operating: 1.71 V to 1.89 V Alternative Parts (Cross-Reference): EPF10K30EFC484-2; EPF10K30EFC484-1XN ; EPF10K30EFC484-1X; EPF10K30EFC256-1X; Introduction Date: August 27, 2003 ECCN: EAR99 Country of Origin: Philippines, Taiwan, Republic of Korea, Singapore Estimated EOL Date: Obsolete / End of life Is this a common-used part?: Yes Popularity: High Fake Threat In the Open Market: 64 pct. Supply and Demand Status: Limited
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Description
Manufacturer: Xilinx Inc. Win Source Part Number: 214082-XC2S50E-6FTG2 56C Mounting: SMD (SMT) Number of I/O: 182 Number of LABs/CLBs: 384 Number of Logic Elements/Cells: 1728 Total RAM Bits: 32768 Number of Gates: 50000 Family Name: XC2S50E Categories: Integrated Circuits Status: Obsolete(EOL) Temperature Range - Operating: 0°C to 85°C (TJ) Case / Package: 256-FTBGA (17x17) Supply Voltage - Operating: 1.71 V to 1.89 V Alternative Parts (Cross-Reference): EPF10K30EFC484-2; EPF10K30EFC484-1XN ; EPF10K30EFC484-1X; EPF10K30EFC256-1X; Introduction Date: August 27, 2003 ECCN: EAR99 Country of Origin: Philippines, Taiwan, Republic of Korea, Singapore Estimated EOL Date: Obsolete / End of life Is this a common-used part?: Yes Popularity: High Fake Threat In the Open Market: 64 pct. Supply and Demand Status: Limited
Request a Quote Datasheet

Suppliers

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Embedded - Embedded - FPGAs (Field Programmable Gate Array) - XC2S50E-6FTG256C - 214082-XC2S50E-6FTG256C - Win Source Electronics
Laguna Hills, CA, United States
Embedded - Embedded - FPGAs (Field Programmable Gate Array) - XC2S50E-6FTG256C
214082-XC2S50E-6FTG256C
Embedded - Embedded - FPGAs (Field Programmable Gate Array) - XC2S50E-6FTG256C 214082-XC2S50E-6FTG256C
Manufacturer: Xilinx Inc. Win Source Part Number: 214082-XC2S50E-6FTG2 56C Mounting: SMD (SMT) Number of I/O: 182 Number of LABs/CLBs: 384 Number of Logic Elements/Cells: 1728 Total RAM Bits: 32768 Number of Gates: 50000 Family Name: XC2S50E Categories: Integrated Circuits Status: Obsolete(EOL) Temperature Range - Operating: 0°C to 85°C (TJ) Case / Package: 256-FTBGA (17x17) Supply Voltage - Operating: 1.71 V to 1.89 V Alternative Parts (Cross-Reference): EPF10K30EFC484-2; EPF10K30EFC484-1XN ; EPF10K30EFC484-1X; EPF10K30EFC256-1X; Introduction Date: August 27, 2003 ECCN: EAR99 Country of Origin: Philippines, Taiwan, Republic of Korea, Singapore Estimated EOL Date: Obsolete / End of life Is this a common-used part?: Yes Popularity: High Fake Threat In the Open Market: 64 pct. Supply and Demand Status: Limited

Manufacturer: Xilinx Inc.
Win Source Part Number: 214082-XC2S50E-6FTG256C
Mounting: SMD (SMT)
Number of I/O: 182
Number of LABs/CLBs: 384
Number of Logic Elements/Cells: 1728
Total RAM Bits: 32768
Number of Gates: 50000
Family Name: XC2S50E
Categories: Integrated Circuits
Status: Obsolete(EOL)
Temperature Range - Operating: 0°C to 85°C (TJ)
Case / Package: 256-FTBGA (17x17)
Supply Voltage - Operating: 1.71 V to 1.89 V
Alternative Parts (Cross-Reference): EPF10K30EFC484-2; EPF10K30EFC484-1XN ; EPF10K30EFC484-1X; EPF10K30EFC256-1X;
Introduction Date: August 27, 2003
ECCN: EAR99
Country of Origin: Philippines, Taiwan, Republic of Korea, Singapore
Estimated EOL Date: Obsolete / End of life
Is this a common-used part?: Yes
Popularity: High
Fake Threat In the Open Market: 64 pct.
Supply and Demand Status: Limited

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Technical Specifications

  Win Source Electronics
Product Category Field-Programmable Gate Arrays (FPGA)
Product Number 214082-XC2S50E-6FTG256C
Product Name Embedded - Embedded - FPGAs (Field Programmable Gate Array) - XC2S50E-6FTG256C
System Gates 50000
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