Xilinx, Inc. Memory - Memory - Configuration Proms for FPGAs - XC17S30APD8I XC17S30APD8I

Description
Manufacturer: Xilinx Inc. Win Source Part Number: 809123-XC17S30APD8I Packaging: Tube Memory Size: 300kb Programmable Type: OTP Part Status: Obsolete (End Of Life) Supplier Device Package: 8-PDIP Temperature Range - Operating: -40°C ~ 85°C Manufacturer Package: 8-DIP Popularity: Medium Fake Threat In the Open Market: 51 pct. Supply and Demand Status: Limited Manufacturer Pack Quantity: 50 MSL Level: Not Applicable Supply Voltage (V): 3V ~ 3.6V Part Number Series: XC17S30
Request a Quote
Description
Manufacturer: Xilinx Inc. Win Source Part Number: 809123-XC17S30APD8I Packaging: Tube Memory Size: 300kb Programmable Type: OTP Part Status: Obsolete (End Of Life) Supplier Device Package: 8-PDIP Temperature Range - Operating: -40°C ~ 85°C Manufacturer Package: 8-DIP Popularity: Medium Fake Threat In the Open Market: 51 pct. Supply and Demand Status: Limited Manufacturer Pack Quantity: 50 MSL Level: Not Applicable Supply Voltage (V): 3V ~ 3.6V Part Number Series: XC17S30
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Memory - Memory - Configuration Proms for FPGAs - XC17S30APD8I - 809123-XC17S30APD8I - Win Source Electronics
Laguna Hills, CA, United States
Memory - Memory - Configuration Proms for FPGAs - XC17S30APD8I
809123-XC17S30APD8I
Memory - Memory - Configuration Proms for FPGAs - XC17S30APD8I 809123-XC17S30APD8I
Manufacturer: Xilinx Inc. Win Source Part Number: 809123-XC17S30APD8I Packaging: Tube Memory Size: 300kb Programmable Type: OTP Part Status: Obsolete (End Of Life) Supplier Device Package: 8-PDIP Temperature Range - Operating: -40°C ~ 85°C Manufacturer Package: 8-DIP Popularity: Medium Fake Threat In the Open Market: 51 pct. Supply and Demand Status: Limited Manufacturer Pack Quantity: 50 MSL Level: Not Applicable Supply Voltage (V): 3V ~ 3.6V Part Number Series: XC17S30

Manufacturer: Xilinx Inc.
Win Source Part Number: 809123-XC17S30APD8I
Packaging: Tube
Memory Size: 300kb
Programmable Type: OTP
Part Status: Obsolete (End Of Life)
Supplier Device Package: 8-PDIP
Temperature Range - Operating: -40°C ~ 85°C
Manufacturer Package: 8-DIP
Popularity: Medium
Fake Threat In the Open Market: 51 pct.
Supply and Demand Status: Limited
Manufacturer Pack Quantity: 50
MSL Level: Not Applicable
Supply Voltage (V): 3V ~ 3.6V
Part Number Series: XC17S30

Buy Now
Integrated Circuits (ICs) - Memory - Configuration Proms for FPGAs - XC17S30APD8I - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory - Configuration Proms for FPGAs
XC17S30APD8I
Integrated Circuits (ICs) - Memory - Configuration Proms for FPGAs XC17S30APD8I
IC PROM SER 30000 I-TEMP 8-DIP

IC PROM SER 30000 I-TEMP 8-DIP

Supplier's Site

Technical Specifications

  Win Source Electronics Shenzhen Shengyu Electronics Technology Limited
Product Category Field-Programmable Gate Arrays (FPGA) Field-Programmable Gate Arrays (FPGA)
Product Number 809123-XC17S30APD8I XC17S30APD8I
Product Name Memory - Memory - Configuration Proms for FPGAs - XC17S30APD8I Integrated Circuits (ICs) - Memory - Configuration Proms for FPGAs
Operating Temperature -40 to 85 C (-40 to 185 F) -40 to 85 C (-40 to 185 F)
Unlock Full Specs
to access all available technical data

Similar Products

Industry Pack FPGA Module - IP-EP200 - Acromag, Inc.
Specs
I/O Interface LVDS; TTL
Operating Temperature 0 to 70 C (32 to 158 F)
View Details
Connect Tech Inc.
Specs
I/O Interface CMOS; TTL
System Gates 500000
Logic Family TTL; CMOS
View Details