Xilinx, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XA7Z010-1CLG225Q

Description
Manufacturer: AMD Xilinx Win Source Part Number: 1318028-XA7Z010-1CLG 225Q Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 667MHz Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 86 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Artix™-7 FPGA, 28K Logic Cells Supplier Device Package: 225-CSPBGA (13x13) Temperature Range - Operating: -40°C ~ 125°C (TJ) Case / Package: 225-LFBGA, CSPBGA ECCN: EAR99 Fake Threat In the Open Market: 75 MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Base Product Number: XA7Z010 RoHS Status: ROHS3 Compliant
Request a Quote Datasheet
Description
Manufacturer: AMD Xilinx Win Source Part Number: 1318028-XA7Z010-1CLG 225Q Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 667MHz Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 86 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Artix™-7 FPGA, 28K Logic Cells Supplier Device Package: 225-CSPBGA (13x13) Temperature Range - Operating: -40°C ~ 125°C (TJ) Case / Package: 225-LFBGA, CSPBGA ECCN: EAR99 Fake Threat In the Open Market: 75 MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Base Product Number: XA7Z010 RoHS Status: ROHS3 Compliant
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1318028-XA7Z010-1CLG225Q - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1318028-XA7Z010-1CLG225Q
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1318028-XA7Z010-1CLG225Q
Manufacturer: AMD Xilinx Win Source Part Number: 1318028-XA7Z010-1CLG 225Q Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 667MHz Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 86 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Artix™-7 FPGA, 28K Logic Cells Supplier Device Package: 225-CSPBGA (13x13) Temperature Range - Operating: -40°C ~ 125°C (TJ) Case / Package: 225-LFBGA, CSPBGA ECCN: EAR99 Fake Threat In the Open Market: 75 MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Base Product Number: XA7Z010 RoHS Status: ROHS3 Compliant

Manufacturer: AMD Xilinx
Win Source Part Number: 1318028-XA7Z010-1CLG225Q
Category: Integrated Circuits (ICs)>Embedded>System On Chip (SoC)
Packaging: Tray
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 667MHz
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 86
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
Supplier Device Package: 225-CSPBGA (13x13)
Temperature Range - Operating: -40°C ~ 125°C (TJ)
Case / Package: 225-LFBGA, CSPBGA
ECCN: EAR99
Fake Threat In the Open Market: 75
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Base Product Number: XA7Z010
RoHS Status: ROHS3 Compliant

Buy Now Datasheet
System On Chip (SoC) - XA7Z010-1CLG225Q-ND - DigiKey
Thief River Falls, MN, United States
System On Chip (SoC)
XA7Z010-1CLG225Q-ND
System On Chip (SoC) XA7Z010-1CLG225Q-ND
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Automotive, AEC-Q100, Zynq®-7000 XA Artix™-7 FPGA, 28K Logic Cells 667MHz 225-CSPBGA (13x13)

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Automotive, AEC-Q100, Zynq®-7000 XA Artix™-7 FPGA, 28K Logic Cells 667MHz 225-CSPBGA (13x13)

Buy Now Datasheet
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - XA7Z010-1CLG225Q - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
XA7Z010-1CLG225Q
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XA7Z010-1CLG225Q
IC SOC CORTEX-A9 667MHZ 225BGA

IC SOC CORTEX-A9 667MHZ 225BGA

Supplier's Site

Technical Specifications

  Win Source Electronics DigiKey Shenzhen Shengyu Electronics Technology Limited
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 1318028-XA7Z010-1CLG225Q XA7Z010-1CLG225Q-ND XA7Z010-1CLG225Q
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC) System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Processor Core ARM ARM ARM
RAM Size 0.2560 MB 0.2560 MB 0.2560 MB
Number of Inputs/Outputs 86 # 86 #
Operating Temperature -40 to 257 F (-40 to 125 C) -40 to 257 F (-40 to 125 C)
Unlock Full Specs
to access all available technical data

Similar Products

System-On-Chips - 8855760P - RS Components, Ltd.
Nordic Semiconductor ASA
Specs
Processor Core Bluetooth Smart
Interface Bluetooth Smart
Package / Case QFN
View Details
Specs
Processor Core ARM
Clock Frequency 2000 to 1000 MHz
RAM Size 1.5 MB
View Details
 - CY8C4246AZI-L423 - Rochester Electronics
Infineon Technologies AG
View Details