Xiamen Innovacera Advanced Materials Co., Ltd. Direct Bonded Copper Substrates

Description
DBC ceramic substrate, short for Direct Bonded Copper Ceramic Substrate, is an advanced material composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together through a hypo-eutectic process. This unique combination of materials results in a substrate with exceptional thermal conductivity, low thermal expansion, high strength, and excellent wettability for soldering applications.
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Direct Bonded Copper Substrates -  - Xiamen Innovacera Advanced Materials Co., Ltd.
Xiamen, China
Direct Bonded Copper Substrates
Direct Bonded Copper Substrates
DBC ceramic substrate, short for Direct Bonded Copper Ceramic Substrate, is an advanced material composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together through a hypo-eutectic process. This unique combination of materials results in a substrate with exceptional thermal conductivity, low thermal expansion, high strength, and excellent wettability for soldering applications.

DBC ceramic substrate, short for Direct Bonded Copper Ceramic Substrate, is an advanced material composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together through a hypo-eutectic process. This unique combination of materials results in a substrate with exceptional thermal conductivity, low thermal expansion, high strength, and excellent wettability for soldering applications.

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Technical Specifications

  Xiamen Innovacera Advanced Materials Co., Ltd.
Product Category Specialty Ceramics
Product Name Direct Bonded Copper Substrates
Applications soldering
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