Winbond Electronics Corporation America Memory W979H2KBVX1I TR

Description
SDRAM - Mobile LPDDR2-S4B Memory IC 512Mb (16M x 32) HSUL_12 533MHz 134-VFBGA (10x11.5)
Request a Quote Datasheet
Description
SDRAM - Mobile LPDDR2-S4B Memory IC 512Mb (16M x 32) HSUL_12 533MHz 134-VFBGA (10x11.5)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - 256-W979H2KBVX1ITR-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - Mobile LPDDR2-S4B Memory IC 512Mb (16M x 32) HSUL_12 533MHz 134-VFBGA (10x11.5)

SDRAM - Mobile LPDDR2-S4B Memory IC 512Mb (16M x 32) HSUL_12 533MHz 134-VFBGA (10x11.5)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - W979H2KBVX1I TR - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory
W979H2KBVX1I TR
Integrated Circuits (ICs) - Memory W979H2KBVX1I TR
512MB LPDDR2, X32, 533MHZ, -40 ~

512MB LPDDR2, X32, 533MHZ, -40 ~

Supplier's Site
512MB LPDDR2, X32, 533MHZ, -40 ~

512MB LPDDR2, X32, 533MHZ, -40 ~

Supplier's Site Datasheet
Memory - W979H2KBVX1I TR - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile LPDDR2-S4B Memory IC 512Mbit HSUL_12 533 MHz 134-VFBGA (10x11.5)

SDRAM - Mobile LPDDR2-S4B Memory IC 512Mbit HSUL_12 533 MHz 134-VFBGA (10x11.5)

Buy Now Datasheet

Technical Specifications

  DigiKey Shenzhen Shengyu Electronics Technology Limited Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 256-W979H2KBVX1ITR-ND W979H2KBVX1I TR W979H2KBVX1I TR W979H2KBVX1I TR
Product Name Memory Integrated Circuits (ICs) - Memory Memory Memory
Memory Category DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip
Operating Temperature -40 to 85 C (-40 to 185 F) -40 to 85 C (-40 to 185 F) -40 to 85 C (-40 to 185 F)
Density 512000 kbits 512000 kbits 512000 kbits 512000 kbits
Unlock Full Specs
to access all available technical data

Similar Products

SMV512K32-SP 16MB Radiation-Hardened SRAM - SMV512K32HFG/EM - Texas Instruments
Specs
Memory Category SRAM Chip
Access Time 20 ns
Density 16000 kbits
View Details
Memory - SMJ416400 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category DRAM; DRAM Chip
Access Time 70 to 100 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details
Memory - 16-3852-01-T - Lingto Electronic Limited
Infineon Technologies AG
View Details
2 suppliers