Winbond Electronics Corporation America Memory W978H2KBVX1E

Description
SDRAM - Mobile LPDDR2-S4B Memory IC 256Mb (8M x 32) HSUL_12 533MHz 5.5ns 134-VFBGA (10x11.5)
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Description
SDRAM - Mobile LPDDR2-S4B Memory IC 256Mb (8M x 32) HSUL_12 533MHz 5.5ns 134-VFBGA (10x11.5)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - 256-W978H2KBVX1E-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - Mobile LPDDR2-S4B Memory IC 256Mb (8M x 32) HSUL_12 533MHz 5.5ns 134-VFBGA (10x11.5)

SDRAM - Mobile LPDDR2-S4B Memory IC 256Mb (8M x 32) HSUL_12 533MHz 5.5ns 134-VFBGA (10x11.5)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - Memory - W978H2KBVX1E - Acme Chip Technology Co., Limited
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
W978H2KBVX1E
Integrated Circuits (ICs) - Memory - Memory W978H2KBVX1E
IC DRAM 256MBIT HSUL 12 134VFBGA

IC DRAM 256MBIT HSUL 12 134VFBGA

Supplier's Site
256MB LPDDR2, X32, 533MHZ, -25 ~

256MB LPDDR2, X32, 533MHZ, -25 ~

Supplier's Site Datasheet
Memory - W978H2KBVX1E - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile LPDDR2-S4B Memory IC 256Mbit HSUL_12 533 MHz 5.5 ns 134-VFBGA (10x11.5)

SDRAM - Mobile LPDDR2-S4B Memory IC 256Mbit HSUL_12 533 MHz 5.5 ns 134-VFBGA (10x11.5)

Buy Now Datasheet

Technical Specifications

  DigiKey Acme Chip Technology Co., Limited Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 256-W978H2KBVX1E-ND W978H2KBVX1E W978H2KBVX1E W978H2KBVX1E
Product Name Memory Integrated Circuits (ICs) - Memory - Memory Memory Memory
Memory Category DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip
Operating Temperature -25 to 85 C (-13 to 185 F) -25 to 85 C (-13 to 185 F)
Density 256000 kbits 256000 kbits 256000 kbits 256000 kbits
Package Type 134-VFBGA 533 MHz BGA; 134-VFBGA
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4 suppliers