Winbond Electronics Corporation America Memory W978H2KBVX1E

Description
SDRAM - Mobile LPDDR2-S4B Memory IC 256Mb (8M x 32) HSUL_12 533MHz 5.5ns 134-VFBGA (10x11.5)
Request a Quote Datasheet
Description
SDRAM - Mobile LPDDR2-S4B Memory IC 256Mb (8M x 32) HSUL_12 533MHz 5.5ns 134-VFBGA (10x11.5)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - 256-W978H2KBVX1E-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - Mobile LPDDR2-S4B Memory IC 256Mb (8M x 32) HSUL_12 533MHz 5.5ns 134-VFBGA (10x11.5)

SDRAM - Mobile LPDDR2-S4B Memory IC 256Mb (8M x 32) HSUL_12 533MHz 5.5ns 134-VFBGA (10x11.5)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - Memory - W978H2KBVX1E - Acme Chip Technology Co., Limited
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
W978H2KBVX1E
Integrated Circuits (ICs) - Memory - Memory W978H2KBVX1E
IC DRAM 256MBIT HSUL 12 134VFBGA

IC DRAM 256MBIT HSUL 12 134VFBGA

Supplier's Site
Memory - W978H2KBVX1E - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile LPDDR2-S4B Memory IC 256Mbit HSUL_12 533 MHz 5.5 ns 134-VFBGA (10x11.5)

SDRAM - Mobile LPDDR2-S4B Memory IC 256Mbit HSUL_12 533 MHz 5.5 ns 134-VFBGA (10x11.5)

Buy Now Datasheet
256MB LPDDR2, X32, 533MHZ, -25 ~

256MB LPDDR2, X32, 533MHZ, -25 ~

Supplier's Site Datasheet

Technical Specifications

  DigiKey Acme Chip Technology Co., Limited Quarktwin Technology Ltd. Lingto Electronic Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 256-W978H2KBVX1E-ND W978H2KBVX1E W978H2KBVX1E W978H2KBVX1E
Product Name Memory Integrated Circuits (ICs) - Memory - Memory Memory Memory
Memory Category DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip
Operating Temperature -25 to 85 C (-13 to 185 F) -25 to 85 C (-13 to 185 F)
Density 256000 kbits 256000 kbits 256000 kbits 256000 kbits
Package Type 134-VFBGA 533 MHz BGA; 134-VFBGA
Unlock Full Specs
to access all available technical data

Similar Products

Flash Memory - 1882861P - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category Flash
Package Type TSOP
Pins 48
View Details
Memory - 24C01-I/P - Lingto Electronic Limited
Rochester Electronics
Specs
Memory Category EEPROM; EEPROM
Access Time 900 ns
Density 1 kbits
View Details
Memory - MYX4DD3K256M16BG1 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category DDR3
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 256000 kbits
View Details