Winbond Electronics Corporation America Memory W978H2KBVX1E TR

Description
SDRAM - Mobile LPDDR2-S4B Memory IC 256Mb (8M x 32) HSUL_12 533MHz 5.5ns 134-VFBGA (10x11.5)
Request a Quote Datasheet
Description
SDRAM - Mobile LPDDR2-S4B Memory IC 256Mb (8M x 32) HSUL_12 533MHz 5.5ns 134-VFBGA (10x11.5)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - 256-W978H2KBVX1ETR-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - Mobile LPDDR2-S4B Memory IC 256Mb (8M x 32) HSUL_12 533MHz 5.5ns 134-VFBGA (10x11.5)

SDRAM - Mobile LPDDR2-S4B Memory IC 256Mb (8M x 32) HSUL_12 533MHz 5.5ns 134-VFBGA (10x11.5)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - W978H2KBVX1E TR - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory
W978H2KBVX1E TR
Integrated Circuits (ICs) - Memory W978H2KBVX1E TR
256MB LPDDR2, X32, 533MHZ, -25 ~

256MB LPDDR2, X32, 533MHZ, -25 ~

Supplier's Site
Memory - W978H2KBVX1E TR - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile LPDDR2-S4B Memory IC 256Mbit HSUL_12 533 MHz 5.5 ns 134-VFBGA (10x11.5)

SDRAM - Mobile LPDDR2-S4B Memory IC 256Mbit HSUL_12 533 MHz 5.5 ns 134-VFBGA (10x11.5)

Buy Now Datasheet
256MB LPDDR2, X32, 533MHZ, -25 ~

256MB LPDDR2, X32, 533MHZ, -25 ~

Supplier's Site Datasheet

Technical Specifications

  DigiKey Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd. Lingto Electronic Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 256-W978H2KBVX1ETR-ND W978H2KBVX1E TR W978H2KBVX1E TR W978H2KBVX1E TR
Product Name Memory Integrated Circuits (ICs) - Memory Memory Memory
Memory Category DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip
Operating Temperature -25 to 85 C (-13 to 185 F) -25 to 85 C (-13 to 185 F) -25 to 85 C (-13 to 185 F)
Density 256000 kbits 256000 kbits 256000 kbits 256000 kbits
Package Type 134-VFBGA BGA BGA; 134-VFBGA
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