Winbond Electronics Corporation America Memory W66CP2NQUAFJ

Description
SDRAM - Mobile LPDDR4 Memory IC 4Gb (128M x 32) LVSTL_11 2.133GHz 3.5ns 200-WFBGA (10x14.5)
Request a Quote Datasheet
Description
SDRAM - Mobile LPDDR4 Memory IC 4Gb (128M x 32) LVSTL_11 2.133GHz 3.5ns 200-WFBGA (10x14.5)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - 256-W66CP2NQUAFJ-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - Mobile LPDDR4 Memory IC 4Gb (128M x 32) LVSTL_11 2.133GHz 3.5ns 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4 Memory IC 4Gb (128M x 32) LVSTL_11 2.133GHz 3.5ns 200-WFBGA (10x14.5)

Buy Now Datasheet
Memory IC and Storage Component - 774-W66CP2NQUAFJ - ERSAELECTRONICS PTE. LTD.
Singapore, Singapore
Memory IC and Storage Component
774-W66CP2NQUAFJ
Memory IC and Storage Component 774-W66CP2NQUAFJ
IC DRAM 4GBIT LVSTL 11 200WFBGA Product overview: W66CP2NQUAFJ from Winbond Electronics Corporation is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-W66CP2NQUAFJ can be used for catalog matching and distributor lookup.

IC DRAM 4GBIT LVSTL 11 200WFBGA Product overview: W66CP2NQUAFJ from Winbond Electronics Corporation is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-W66CP2NQUAFJ can be used for catalog matching and distributor lookup.

Supplier's Site Datasheet
4GB LPDDR4, DDP, X32, 1600MHZ, -

4GB LPDDR4, DDP, X32, 1600MHZ, -

Supplier's Site Datasheet
4GB LPDDR4, DDP, X32, 1600MHZ,

4GB LPDDR4, DDP, X32, 1600MHZ,

Supplier's Site Datasheet
Memory - W66CP2NQUAFJ - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile LPDDR4 Memory IC 4Gbit LVSTL_11 2.133 GHz 3.5 ns 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4 Memory IC 4Gbit LVSTL_11 2.133 GHz 3.5 ns 200-WFBGA (10x14.5)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - Memory - W66CP2NQUAFJ - Acme Chip Technology Co., Limited
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
W66CP2NQUAFJ
Integrated Circuits (ICs) - Memory - Memory W66CP2NQUAFJ
IC DRAM 4GBIT LVSTL 11 200WFBGA

IC DRAM 4GBIT LVSTL 11 200WFBGA

Supplier's Site

Technical Specifications

  DigiKey ERSAELECTRONICS PTE. LTD. ODG (Origin Data Global) Lingto Electronic Limited Quarktwin Technology Ltd. Acme Chip Technology Co., Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 256-W66CP2NQUAFJ-ND 774-W66CP2NQUAFJ W66CP2NQUAFJ W66CP2NQUAFJ W66CP2NQUAFJ W66CP2NQUAFJ
Product Name Memory Memory IC and Storage Component Memory Memory Memory Integrated Circuits (ICs) - Memory - Memory
Memory Category DRAM Chip DRAM Chip SDRAM - Mobile LPDDR4 DRAM; DRAM Chip DRAM; DRAM Chip Volatile; DRAM Chip
Operating Temperature -40 to 105 C (-40 to 221 F) -40 C (-40 F) -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F)
Package Type 200-WFBGA 200-WFBGA BGA; 200-WFBGA 2.133 GHz
Supply Voltage 1.06V ~ 1.17V, 1.7V ~ 1.95V 1.06~1.7 1.06V ~ 1.17V, 1.7V ~ 1.95V 1.06V ~ 1.17V, 1.7V ~ 1.95V Surface Mount
Access Time 3.5 ns 3.5 ns 3.5 ns 3.5 ns
Unlock Full Specs
to access all available technical data

Similar Products

SDRAM - 1882676 - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category DRAM Chip
Access Time 5 ns
Bits per Word 8 bits
View Details
Memory IC and Storage Component - 774-JBP18S030MJ - ERSAELECTRONICS PTE. LTD.
Specs
Memory Category PROM
Operating Temperature -55 C (-67 F)
Density 0 kbits
View Details
4 suppliers
Memory - AS4C1259 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category DRAM; DRAM Chip
Access Time 100 to 150 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details