Winbond Electronics Corporation America Memory W66CP2NQUAFJ TR

Description
SDRAM - Mobile LPDDR4 Memory IC 4Gb (128M x 32) LVSTL_11 2.133GHz 3.5ns 200-WFBGA (10x14.5)
Request a Quote Datasheet
Description
SDRAM - Mobile LPDDR4 Memory IC 4Gb (128M x 32) LVSTL_11 2.133GHz 3.5ns 200-WFBGA (10x14.5)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - 256-W66CP2NQUAFJTR-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - Mobile LPDDR4 Memory IC 4Gb (128M x 32) LVSTL_11 2.133GHz 3.5ns 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4 Memory IC 4Gb (128M x 32) LVSTL_11 2.133GHz 3.5ns 200-WFBGA (10x14.5)

Buy Now Datasheet
4GB LPDDR4, DDP, X32, 1600MHZ,

4GB LPDDR4, DDP, X32, 1600MHZ,

Supplier's Site Datasheet
Memory - W66CP2NQUAFJ TR - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile LPDDR4 Memory IC 4Gbit LVSTL_11 2.133 GHz 3.5 ns 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4 Memory IC 4Gbit LVSTL_11 2.133 GHz 3.5 ns 200-WFBGA (10x14.5)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - W66CP2NQUAFJ TR - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory
W66CP2NQUAFJ TR
Integrated Circuits (ICs) - Memory W66CP2NQUAFJ TR
4GB LPDDR4, DDP, X32, 1600MHZ, -

4GB LPDDR4, DDP, X32, 1600MHZ, -

Supplier's Site

Technical Specifications

  DigiKey Lingto Electronic Limited Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 256-W66CP2NQUAFJTR-ND W66CP2NQUAFJ TR W66CP2NQUAFJ TR W66CP2NQUAFJ TR
Product Name Memory Memory Memory Integrated Circuits (ICs) - Memory
Memory Category DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip Volatile; DRAM Chip
Operating Temperature -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F)
Package Type 200-WFBGA BGA; 200-WFBGA BGA
Supply Voltage 1.06V ~ 1.17V, 1.7V ~ 1.95V 1.06V ~ 1.17V, 1.7V ~ 1.95V 1.06V ~ 1.17V, 1.7V ~ 1.95V
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