Winbond Electronics Corporation America Memory W66CP2NQUAFJ TR

Description
SDRAM - Mobile LPDDR4 Memory IC 4Gb (128M x 32) LVSTL_11 2.133GHz 3.5ns 200-WFBGA (10x14.5)
Request a Quote Datasheet
Description
SDRAM - Mobile LPDDR4 Memory IC 4Gb (128M x 32) LVSTL_11 2.133GHz 3.5ns 200-WFBGA (10x14.5)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - 256-W66CP2NQUAFJTR-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - Mobile LPDDR4 Memory IC 4Gb (128M x 32) LVSTL_11 2.133GHz 3.5ns 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4 Memory IC 4Gb (128M x 32) LVSTL_11 2.133GHz 3.5ns 200-WFBGA (10x14.5)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - W66CP2NQUAFJ TR - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory
W66CP2NQUAFJ TR
Integrated Circuits (ICs) - Memory W66CP2NQUAFJ TR
4GB LPDDR4, DDP, X32, 1600MHZ, -

4GB LPDDR4, DDP, X32, 1600MHZ, -

Supplier's Site
4GB LPDDR4, DDP, X32, 1600MHZ,

4GB LPDDR4, DDP, X32, 1600MHZ,

Supplier's Site Datasheet
Memory - W66CP2NQUAFJ TR - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile LPDDR4 Memory IC 4Gbit LVSTL_11 2.133 GHz 3.5 ns 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4 Memory IC 4Gbit LVSTL_11 2.133 GHz 3.5 ns 200-WFBGA (10x14.5)

Buy Now Datasheet

Technical Specifications

  DigiKey Shenzhen Shengyu Electronics Technology Limited Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 256-W66CP2NQUAFJTR-ND W66CP2NQUAFJ TR W66CP2NQUAFJ TR W66CP2NQUAFJ TR
Product Name Memory Integrated Circuits (ICs) - Memory Memory Memory
Memory Category DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip
Operating Temperature -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F)
Package Type 200-WFBGA BGA BGA; 200-WFBGA
Supply Voltage 1.06V ~ 1.17V, 1.7V ~ 1.95V 1.06V ~ 1.17V, 1.7V ~ 1.95V 1.06V ~ 1.17V, 1.7V ~ 1.95V
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