Winbond Electronics Corporation America Memory W66CM2NQUAFJ

Description
SDRAM - Mobile LPDDR4X Memory IC 4Gb (128M x 32) LVSTL_11 1.6GHz 3.5ns 200-WFBGA (10x14.5)
Request a Quote Datasheet
Description
SDRAM - Mobile LPDDR4X Memory IC 4Gb (128M x 32) LVSTL_11 1.6GHz 3.5ns 200-WFBGA (10x14.5)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - 256-W66CM2NQUAFJ-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - Mobile LPDDR4X Memory IC 4Gb (128M x 32) LVSTL_11 1.6GHz 3.5ns 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4X Memory IC 4Gb (128M x 32) LVSTL_11 1.6GHz 3.5ns 200-WFBGA (10x14.5)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - Memory - W66CM2NQUAFJ - Acme Chip Technology Co., Limited
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
W66CM2NQUAFJ
Integrated Circuits (ICs) - Memory - Memory W66CM2NQUAFJ
IC DRAM 4GBIT LVSTL 11 200WFBGA

IC DRAM 4GBIT LVSTL 11 200WFBGA

Supplier's Site
4GB LPDDR4X, DDP, X32, 1600MHZ,

4GB LPDDR4X, DDP, X32, 1600MHZ,

Supplier's Site Datasheet
Memory - W66CM2NQUAFJ - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile LPDDR4X Memory IC 4Gbit LVSTL_11 1.6 GHz 3.5 ns 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4X Memory IC 4Gbit LVSTL_11 1.6 GHz 3.5 ns 200-WFBGA (10x14.5)

Buy Now Datasheet

Technical Specifications

  DigiKey Acme Chip Technology Co., Limited Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 256-W66CM2NQUAFJ-ND W66CM2NQUAFJ W66CM2NQUAFJ W66CM2NQUAFJ
Product Name Memory Integrated Circuits (ICs) - Memory - Memory Memory Memory
Memory Category DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip
Operating Temperature -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F)
Package Type 200-WFBGA Not Verified BGA; 200-WFBGA
Unlock Full Specs
to access all available technical data

Similar Products

Memory - 27S185ALM/B - Lingto Electronic Limited
Rochester Electronics
View Details
3 suppliers
 - PC16550DV/NOPB - Rochester Electronics
Texas Instruments
Specs
Memory Category FIFO
Package Type PLCC; PLCC44
View Details
Memory - SMJ4C1024 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category DRAM; DRAM Chip
Access Time 80 to 150 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details
SDRAM - 2420770P - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category DRAM Chip
Access Time 20 ns
Number of Words 128000 k
View Details