Winbond Electronics Corporation America Memory W66CM2NQUAFJ

Description
SDRAM - Mobile LPDDR4X Memory IC 4Gb (128M x 32) LVSTL_11 1.6GHz 3.5ns 200-WFBGA (10x14.5)
Request a Quote Datasheet
Description
SDRAM - Mobile LPDDR4X Memory IC 4Gb (128M x 32) LVSTL_11 1.6GHz 3.5ns 200-WFBGA (10x14.5)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - 256-W66CM2NQUAFJ-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - Mobile LPDDR4X Memory IC 4Gb (128M x 32) LVSTL_11 1.6GHz 3.5ns 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4X Memory IC 4Gb (128M x 32) LVSTL_11 1.6GHz 3.5ns 200-WFBGA (10x14.5)

Buy Now Datasheet
4GB LPDDR4X, DDP, X32, 1600MHZ,

4GB LPDDR4X, DDP, X32, 1600MHZ,

Supplier's Site Datasheet
Memory - W66CM2NQUAFJ - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile LPDDR4X Memory IC 4Gbit LVSTL_11 1.6 GHz 3.5 ns 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4X Memory IC 4Gbit LVSTL_11 1.6 GHz 3.5 ns 200-WFBGA (10x14.5)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - Memory - W66CM2NQUAFJ - Acme Chip Technology Co., Limited
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
W66CM2NQUAFJ
Integrated Circuits (ICs) - Memory - Memory W66CM2NQUAFJ
IC DRAM 4GBIT LVSTL 11 200WFBGA

IC DRAM 4GBIT LVSTL 11 200WFBGA

Supplier's Site

Technical Specifications

  DigiKey Lingto Electronic Limited Quarktwin Technology Ltd. Acme Chip Technology Co., Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 256-W66CM2NQUAFJ-ND W66CM2NQUAFJ W66CM2NQUAFJ W66CM2NQUAFJ
Product Name Memory Memory Memory Integrated Circuits (ICs) - Memory - Memory
Memory Category DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip
Operating Temperature -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F)
Package Type 200-WFBGA BGA; 200-WFBGA Not Verified
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