Winbond Electronics Corporation America Memory W63AH6NBVADE TR

Description
SDRAM - Mobile LPDDR3 Memory IC 1Gb (64M x 16) HSUL_12 1.066GHz 5.5ns 178-VFBGA (11x11.5)
Request a Quote Datasheet
Description
SDRAM - Mobile LPDDR3 Memory IC 1Gb (64M x 16) HSUL_12 1.066GHz 5.5ns 178-VFBGA (11x11.5)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - 256-W63AH6NBVADETR-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - Mobile LPDDR3 Memory IC 1Gb (64M x 16) HSUL_12 1.066GHz 5.5ns 178-VFBGA (11x11.5)

SDRAM - Mobile LPDDR3 Memory IC 1Gb (64M x 16) HSUL_12 1.066GHz 5.5ns 178-VFBGA (11x11.5)

Buy Now Datasheet
1GB LPDDR3, X16, 1066MHZ, T&R

1GB LPDDR3, X16, 1066MHZ, T&R

Supplier's Site Datasheet
Integrated Circuits (ICs) - Memory - W63AH6NBVADE TR - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory
W63AH6NBVADE TR
Integrated Circuits (ICs) - Memory W63AH6NBVADE TR
1GB LPDDR3, X16, 1066MHZ, T&R

1GB LPDDR3, X16, 1066MHZ, T&R

Supplier's Site
Memory - W63AH6NBVADE TR - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile LPDDR3 Memory IC 1Gbit HSUL_12 1.066 GHz 5.5 ns 178-VFBGA (11x11.5)

SDRAM - Mobile LPDDR3 Memory IC 1Gbit HSUL_12 1.066 GHz 5.5 ns 178-VFBGA (11x11.5)

Buy Now Datasheet

Technical Specifications

  DigiKey Lingto Electronic Limited Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 256-W63AH6NBVADETR-ND W63AH6NBVADE TR W63AH6NBVADE TR W63AH6NBVADE TR
Product Name Memory Memory Integrated Circuits (ICs) - Memory Memory
Memory Category DRAM Chip DRAM; DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip
Operating Temperature -25 to 85 C (-13 to 185 F) -25 to 85 C (-13 to 185 F) -25 to 85 C (-13 to 185 F)
Package Type 178-VFBGA BGA BGA; 178-VFBGA
Supply Voltage 1.14V ~ 1.3V, 1.7V ~ 1.95V 1.14V ~ 1.3V, 1.7V ~ 1.95V 1.14V ~ 1.3V, 1.7V ~ 1.95V
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