Winbond Electronics Corporation America DRAM W632GU8NB09I

Description
Category: DRAM Win Source Part Number: 1446737-W632GU8NB09I Manufacturer: Winbond Electronics
Request a Quote Datasheet
Description
Category: DRAM Win Source Part Number: 1446737-W632GU8NB09I Manufacturer: Winbond Electronics
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
DRAM - 1446737-W632GU8NB09I - Win Source Electronics
Laguna Hills, CA, United States
Category: DRAM Win Source Part Number: 1446737-W632GU8NB09I Manufacturer: Winbond Electronics

Category: DRAM
Win Source Part Number: 1446737-W632GU8NB09I
Manufacturer: Winbond Electronics

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Memory - W632GU8NB09I-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - DDR3L Memory IC 2Gb (256M x 8) Parallel 1.067GHz 20ns 78-VFBGA (8x10.5)

SDRAM - DDR3L Memory IC 2Gb (256M x 8) Parallel 1.067GHz 20ns 78-VFBGA (8x10.5)

Buy Now Datasheet
Memory IC and Storage Component - 774-W632GU8NB09I - ERSAELECTRONICS PTE. LTD.
Singapore, Singapore
Memory IC and Storage Component
774-W632GU8NB09I
Memory IC and Storage Component 774-W632GU8NB09I
IC DRAM 2GBIT PAR 78VFBGA Product overview: W632GU8NB09I from Winbond Electronics Corporation is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-W632GU8NB09I can be used for catalog matching and distributor lookup.

IC DRAM 2GBIT PAR 78VFBGA Product overview: W632GU8NB09I from Winbond Electronics Corporation is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-W632GU8NB09I can be used for catalog matching and distributor lookup.

Supplier's Site Datasheet
Memory - W632GU8NB09I - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - DDR3L Memory IC 2Gbit Parallel 1.067 GHz 20 ns 78-VFBGA (8x10.5)

SDRAM - DDR3L Memory IC 2Gbit Parallel 1.067 GHz 20 ns 78-VFBGA (8x10.5)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - Memory - W632GU8NB09I - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory - Memory
W632GU8NB09I
Integrated Circuits (ICs) - Memory - Memory W632GU8NB09I
IC DRAM 2GBIT PAR 78VFBGA

IC DRAM 2GBIT PAR 78VFBGA

Supplier's Site
IC DRAM 2GBIT PARALLEL 78VFBGA

IC DRAM 2GBIT PARALLEL 78VFBGA

Supplier's Site Datasheet

Technical Specifications

  Win Source Electronics DigiKey ERSAELECTRONICS PTE. LTD. Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited Lingto Electronic Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 1446737-W632GU8NB09I W632GU8NB09I-ND 774-W632GU8NB09I W632GU8NB09I W632GU8NB09I W632GU8NB09I
Product Name DRAM Memory Memory IC and Storage Component Memory Integrated Circuits (ICs) - Memory - Memory Memory
Memory Category DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip
Operating Temperature -40 to 95 C (-40 to 203 F) -40 to 95 C (-40 to 203 F) -40 to 95 C (-40 to 203 F)
Package Type 78-VFBGA BGA; Tray BGA; 78-VFBGA
Supply Voltage 1.283V ~ 1.45V 1.283V ~ 1.45V 1.283V ~ 1.45V Surface Mount
Access Time 20 ns 20 ns 20 ns
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