Winbond Electronics Corporation America Memory W632GG6MB09J

Description
SDRAM - DDR3 Memory IC 2Gb (128M x 16) Parallel 1.067GHz 20ns 96-VFBGA (7.5x13)
Request a Quote Datasheet
Description
SDRAM - DDR3 Memory IC 2Gb (128M x 16) Parallel 1.067GHz 20ns 96-VFBGA (7.5x13)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - W632GG6MB09J-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - DDR3 Memory IC 2Gb (128M x 16) Parallel 1.067GHz 20ns 96-VFBGA (7.5x13)

SDRAM - DDR3 Memory IC 2Gb (128M x 16) Parallel 1.067GHz 20ns 96-VFBGA (7.5x13)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - W632GG6MB09J - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory
W632GG6MB09J
Integrated Circuits (ICs) - Memory W632GG6MB09J
IC DRAM 2GBIT PARALLEL 96VFBGA

IC DRAM 2GBIT PARALLEL 96VFBGA

Supplier's Site
IC DRAM 2GBIT PARALLEL 96VFBGA

IC DRAM 2GBIT PARALLEL 96VFBGA

Supplier's Site Datasheet
Memory - W632GG6MB09J - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - DDR3 Memory IC 2Gbit Parallel 1.067 GHz 20 ns 96-VFBGA (7.5x13)

SDRAM - DDR3 Memory IC 2Gbit Parallel 1.067 GHz 20 ns 96-VFBGA (7.5x13)

Buy Now Datasheet

Technical Specifications

  DigiKey Shenzhen Shengyu Electronics Technology Limited Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number W632GG6MB09J-ND W632GG6MB09J W632GG6MB09J W632GG6MB09J
Product Name Memory Integrated Circuits (ICs) - Memory Memory Memory
Memory Category DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip
Operating Temperature -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F)
Package Type 96-VFBGA BGA BGA; 96-VFBGA
Supply Voltage 1.425V ~ 1.575V 1.425V ~ 1.575V 1.425V ~ 1.575V
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