WINBOND ELECTRONICS CORPORATION AMERICA
W35N01JWTBIG -- MEMORY
Winbond Electronics Corporation America
Memory
W35N01JWTBIG
Technical Specifications
|
Product Category
|
Memory Chips |
|
Product Number
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W35N01JWTBIG |
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Product Name
|
Memory |
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Memory Category
Flash
Density
1024000 kbits
Package Type
SOIC; SOIC
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Memory Category
EEPROM; EEPROM
Access Time
250 to 300 ns
Operating Temperature
-55 to 125 C (-67 to 257 F)
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Memory Category
FIFO
Package Type
CDIP,DIESALE
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