Winbond Electronics Corporation America Memory IC and Storage Component W25Q512NWBIM

IC FLASH 512MBIT SPI 24TFBGA Product overview: W25Q512NWBIM from Winbond Electronics Corporation is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-W25Q512NWBIM can be used for catalog matching and distributor lookup.

Win Source Part Number: 1352239-W25Q512NWBIM
Category: Integrated Circuits (ICs) - Memory - Memory
Series: SpiFlash®
Package: Tray
Standard Package: 480
Technology: FLASH - NOR
Memory Type: Non-Volatile
Memory Size: 512Mbit
Access Time: 6 ns
Voltage - Supply: 1.65V ~ 1.95V
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Supplier Device Package: 24-TFBGA (6x8)
Temperature Range - Operating: -40°C ~ 85°C (TA)
Memory Format: FLASH
Clock Frequency: 133 MHz
Write Cycle Time - Word, Page: 3ms
Memory Interface: SPI - Quad I/O, QPI, DTR
ECCN: 3A991B1A
Fake Threat In the Open Market: 58 pct.
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.32.0071
Mfr: Winbond Electronics
Base Product Number: W25Q512
Memory Organization: 64M x 8

FLASH - NOR Memory IC 512Mb (64M x 8) SPI - Quad I/O, QPI, DTR 133MHz 6ns 24-TFBGA (8x6)