WINBOND ELECTRONICS CORPORATION AMERICA
W25Q128FVSBQ -- MEMORY
Winbond Electronics Corporation America
Memory
W25Q128FVSBQ
-
Lingto Electronic Limited
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Quarktwin Technology Ltd.
Datasheet
Datasheet
Suppliers
Supplier's Site
Datasheet
Technical Specifications
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Product Category
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Memory Chips |
Memory Chips |
Memory Chips |
|
Product Number
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W25Q128FVSBQ |
W25Q128FVSBQ |
W25Q128FVSBQ |
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Product Name
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Memory |
Memory |
Integrated Circuits (ICs) - Memory - Memory |
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Package Type
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SOIC; 8-SOIC (0.209\", 5.30mm Width)
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SOIC; 8-SOIC
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Similar Products
Memory Category
DDR2
Operating Temperature
-55 to 125 C (-67 to 257 F)
Density
256000 kbits
View Details
Operating Temperature
0 to 70 C (32 to 158 F)
Density
2 kbits
Package Type
DIP; 28-DIP (0.300\", 7.62mm)
View Details
Memory Category
DRAM Chip
Access Time
0.4000 ns
Number of Words
64000 k
View Details
