WINBOND ELECTRONICS CORPORATION AMERICA
W25Q128FVFBQ -- INTEGRATED CIRCUITS (ICS) - MEMORY
Winbond Electronics Corporation America
Integrated Circuits (ICs) - Memory
W25Q128FVFBQ
-
Shenzhen Shengyu Electronics Technology Limited
-
Quarktwin Technology Ltd.
-
Lingto Electronic Limited
Datasheet
Datasheet
Suppliers
Supplier's Site
Datasheet
Technical Specifications
|
Product Category
|
Memory Chips |
Memory Chips |
Memory Chips |
|
Product Number
|
W25Q128FVFBQ |
W25Q128FVFBQ |
W25Q128FVFBQ |
|
Product Name
|
Integrated Circuits (ICs) - Memory |
Memory |
Memory |
|
Package Type
|
|
SOIC; 16-SOIC (0.295\", 7.50mm Width)
|
|
Unlock Full Specs
to access all available technical data
Similar Products
Memory Category
SRAM; SRAM Chip
Access Time
45 ns
Density
16 kbits
View Details
Memory Category
Flash
Package Type
TSOP
Pins
48
View Details
Memory Category
SRAM Chip
Operating Temperature
-55 C (-67 F)
Density
1000 kbits
View Details
2 suppliers