WINBOND ELECTRONICS CORPORATION AMERICA
W25Q128FVFBQ -- INTEGRATED CIRCUITS (ICS) - MEMORY
Winbond Electronics Corporation America
Integrated Circuits (ICs) - Memory
W25Q128FVFBQ
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Shenzhen Shengyu Electronics Technology Limited
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Lingto Electronic Limited
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Quarktwin Technology Ltd.
Datasheet
Datasheet
Suppliers
Supplier's Site
Datasheet
Technical Specifications
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Product Category
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Memory Chips |
Memory Chips |
Memory Chips |
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Product Number
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W25Q128FVFBQ |
W25Q128FVFBQ |
W25Q128FVFBQ |
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Product Name
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Integrated Circuits (ICs) - Memory |
Memory |
Memory |
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Package Type
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|
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SOIC; 16-SOIC (0.295\", 7.50mm Width)
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Similar Products
Memory Category
EEPROM; EEPROM
Access Time
250 to 300 ns
Operating Temperature
-55 to 125 C (-67 to 257 F)
View Details
Memory Category
DRAM Chip
Access Time
5 ns
Density
4096000 kbits
View Details
Memory Category
FIFO
Package Type
SOIC
View Details
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