WINBOND ELECTRONICS CORPORATION AMERICA
W25Q128FVBAQ -- MEMORY
Winbond Electronics Corporation America
Memory
W25Q128FVBAQ
Description
Memory IC 24-TFBGA (6x8)
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Quarktwin Technology Ltd.
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Lingto Electronic Limited
Datasheet
Description
Memory IC 24-TFBGA (6x8)
Datasheet
Suppliers
Supplier's Site
Datasheet
Technical Specifications
|
Product Category
|
Memory Chips |
Memory Chips |
Memory Chips |
|
Product Number
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W25Q128FVBAQ |
W25Q128FVBAQ |
W25Q128FVBAQ |
|
Product Name
|
Memory |
Memory |
Integrated Circuits (ICs) - Memory - Memory |
|
Package Type
|
BGA; 24-TBGA
|
|
BGA; 24-TFBGA (6x8)
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Memory Category
SRAM; SRAM Chip
Access Time
15 ns
Density
256 kbits
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Memory Category
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Operating Temperature
0 to 70 C (32 to 158 F)
Density
1 kbits
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Memory Category
Flash
Package Type
VFBGA
Pins
63
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