Win Source Electronics Fans, Thermal Management - Thermal - Pads, Sheets HF115AC-0.0055-AC-90

Description
Win Source Part Number: 1351452-HF115AC-0.00 55-AC-90 Category: Fans, Thermal Management - Thermal - Pads, Sheets Series: Hi-Flow® 115-AC Type: Pad, Sheet Color: Gray Package: Bulk Usage: TO-218, TO-220, TO-247 Standard Package: 100 Thickness: 0.0055" (0.140mm) Outline: 21.84mm x 18.79mm Material: Phase Change Compound Shape: Rectangular Adhesive: Adhesive - One Side Backing, Carrier: Fiberglass Thermal Resistivity: 0.35°C/W Thermal Conductivity: 0.8W/m-K ECCN: EAR99 Fake Threat In the Open Market: 54 pct. MSL Level: 1 (Unlimited) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months HTSUS: 3919.90.5060 Mfr: Bergquist Base Product Number: HF115AC
  • Fans, Thermal Management - Thermal - Pads, Sheets - HF115AC-0.0055-AC-90 - Win Source Electronics
    Win Source Electronics
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Description
Win Source Part Number: 1351452-HF115AC-0.00 55-AC-90 Category: Fans, Thermal Management - Thermal - Pads, Sheets Series: Hi-Flow® 115-AC Type: Pad, Sheet Color: Gray Package: Bulk Usage: TO-218, TO-220, TO-247 Standard Package: 100 Thickness: 0.0055" (0.140mm) Outline: 21.84mm x 18.79mm Material: Phase Change Compound Shape: Rectangular Adhesive: Adhesive - One Side Backing, Carrier: Fiberglass Thermal Resistivity: 0.35°C/W Thermal Conductivity: 0.8W/m-K ECCN: EAR99 Fake Threat In the Open Market: 54 pct. MSL Level: 1 (Unlimited) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months HTSUS: 3919.90.5060 Mfr: Bergquist Base Product Number: HF115AC
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Fans, Thermal Management - Thermal - Pads, Sheets - HF115AC-0.0055-AC-90 - Win Source Electronics
Win Source Electronics
Laguna Hills, CA, United States
Fans, Thermal Management - Thermal - Pads, Sheets
HF115AC-0.0055-AC-90
Fans, Thermal Management - Thermal - Pads, Sheets HF115AC-0.0055-AC-90
Win Source Part Number: 1351452-HF115AC-0.00 55-AC-90 Category: Fans, Thermal Management - Thermal - Pads, Sheets Series: Hi-Flow® 115-AC Type: Pad, Sheet Color: Gray Package: Bulk Usage: TO-218, TO-220, TO-247 Standard Package: 100 Thickness: 0.0055" (0.140mm) Outline: 21.84mm x 18.79mm Material: Phase Change Compound Shape: Rectangular Adhesive: Adhesive - One Side Backing, Carrier: Fiberglass Thermal Resistivity: 0.35°C/W Thermal Conductivity: 0.8W/m-K ECCN: EAR99 Fake Threat In the Open Market: 54 pct. MSL Level: 1 (Unlimited) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months HTSUS: 3919.90.5060 Mfr: Bergquist Base Product Number: HF115AC

Win Source Part Number: 1351452-HF115AC-0.0055-AC-90
Category: Fans, Thermal Management - Thermal - Pads, Sheets
Series: Hi-Flow® 115-AC
Type: Pad, Sheet
Color: Gray
Package: Bulk
Usage: TO-218, TO-220, TO-247
Standard Package: 100
Thickness: 0.0055" (0.140mm)
Outline: 21.84mm x 18.79mm
Material: Phase Change Compound
Shape: Rectangular
Adhesive: Adhesive - One Side
Backing, Carrier: Fiberglass
Thermal Resistivity: 0.35°C/W
Thermal Conductivity: 0.8W/m-K
ECCN: EAR99
Fake Threat In the Open Market: 54 pct.
MSL Level: 1 (Unlimited)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
HTSUS: 3919.90.5060
Mfr: Bergquist
Base Product Number: HF115AC

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Technical Specifications

  Win Source Electronics
Product Category Thermal Compounds and Thermal Interface Materials
Product Number HF115AC-0.0055-AC-90
Product Name Fans, Thermal Management - Thermal - Pads, Sheets
Thermal Conductivity 0.8000 W/m-K (0.4622 BTU-ft/hr-ft²-F)
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