Wakefield Thermal, Inc.
Thermal Adhesive/Compound/Material
PPIM00004
Description
0.77"" x 0.77"" Tape
Request a Quote
Email Supplier
Description
0.77"" x 0.77"" Tape
Request a Quote
Email Supplier
Technical Specifications
|
Product Category
|
Thermal Compounds and Thermal Interface Materials |
|
Product Number
|
PPIM00004 |
|
Product Name
|
Thermal Adhesive/Compound/Material |
Unlock Full Specs
to access all available technical data
Similar Products
Cure / Technology
Two Component ; Addition
Industry
Automotive; Electronics; OEM or Industrial
Features
Flame Retardant; UL Rating
View Details
Hernon Manufacturing, Inc.
Cure / Technology
Room Temperature Vulcanizing or Curing
Industry
Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Quantaflex Printed Electronics Inc.
Form / Shape
Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry
Electronics; Semiconductors, IC's
Features
EMI/RFI Shielding
View Details
Type
High Dielectric
Cure / Technology
Thermoset; Two Component
Form / Shape
Optional Premixed and Frozen; Grease, Paste; Gap Filler, Foam in Place Gasket
View Details
