Wakefield Thermal, Inc.
Thermal Adhesive/Compound/Material
PPIM00004
Description
0.77"" x 0.77"" Tape
Request a Quote
Email Supplier
Description
0.77"" x 0.77"" Tape
Request a Quote
Email Supplier
Technical Specifications
Product Category
|
Thermal Compounds and Thermal Interface Materials |
Product Number
|
PPIM00004 |
Product Name
|
Thermal Adhesive/Compound/Material |
Unlock Full Specs
to access all available technical data
Similar Products
MacDermid Alpha Electronics Solutions
Form / Shape
Gap Filler, Foam in Place Gasket
Chemical System
Silicone
Industry
Electronics
View Details
Dongguan Sheen Electronic Technology Co., Ltd.
Form / Shape
Gel
Chemical System
Silicone
Industry
Electronics
View Details
Form / Shape
Pad
Use Temperature
-400 to 572 F (-240 to 300 C)
Thermal Conductivity
5 to 240 W/m-K (2.89 to 139 BTU-ft/hr-ft²-F)
View Details
Hernon Manufacturing, Inc.
Cure / Technology
Room Temperature Vulcanizing or Curing
Form / Shape
300 ml cartridge (10:2 ratio)
Industry
Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details