Wakefield Thermal, Inc.
Thermal Adhesive/Compound/Material
PPIM00004
Description
0.77"" x 0.77"" Tape
Request a Quote
Email Supplier
Description
0.77"" x 0.77"" Tape
Request a Quote
Email Supplier
Technical Specifications
|
Product Category
|
Thermal Compounds and Thermal Interface Materials |
|
Product Number
|
PPIM00004 |
|
Product Name
|
Thermal Adhesive/Compound/Material |
Unlock Full Specs
to access all available technical data
Similar Products
Cure / Technology
Single Component
Form / Shape
Liquid; Gap Filler, Foam in Place Gasket
Use Temperature
32 to 410 F (0 to 210 C)
View Details
Thermal Conductivity
1.5 W/m-K (0.8667 BTU-ft/hr-ft²-F)
View Details
Cure / Technology
Thermoset; Two Component
Form / Shape
Liquid; Optional Premixed and Frozen; Gap Filler, Foam in Place Gasket
Chemical System
Epoxy
View Details
Quantaflex Printed Electronics Inc.
Form / Shape
Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry
Electronics; Semiconductors, IC's
Features
EMI/RFI Shielding
View Details