Wakefield Thermal, Inc. Thermal Adhesive/Compound/Material PL-1-3-254-H

Description
Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the world's leading suppliers of RF, Wireless, Energy and Power Technologies.
Request a Quote Datasheet
Description
Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the world's leading suppliers of RF, Wireless, Energy and Power Technologies.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Adhesive/Compound/Material - PL-1-3-254-H - Richardson RFPD
Downers Grove, IL, United States
Thermal Adhesive/Compound/Material
PL-1-3-254-H
Thermal Adhesive/Compound/Material PL-1-3-254-H
Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the world's leading suppliers of RF, Wireless, Energy and Power Technologies.

Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the world's leading suppliers of RF, Wireless, Energy and Power Technologies.

Supplier's Site Datasheet

Technical Specifications

  Richardson RFPD
Product Category Thermal Compounds and Thermal Interface Materials
Product Number PL-1-3-254-H
Product Name Thermal Adhesive/Compound/Material
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-85 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 450 F (0 to 232 C)
View Details
No Mix, Thermally Conductive Epoxy Adhesive - EP3RR-80 - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Glob Top, Daub, Doming or Overfill; Gap Filler, Foam in Place Gasket
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details