Wakefield Thermal, Inc. Phase Change Pad, Chipset, 17.5Mm; Thickness Wakefield Thermal CD-02-05-C-18

Description
PHASE CHANGE PAD, CHIPSET, 17.5MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:17.5mm; External Width:17.5mm; Product Range:ulTIMiFlux Series RoHS Compliant: Yes
  • Phase Change Pad, Chipset, 17.5Mm; Thickness Wakefield Thermal - 62AC1396 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
PHASE CHANGE PAD, CHIPSET, 17.5MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:17.5mm; External Width:17.5mm; Product Range:ulTIMiFlux Series RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Phase Change Pad, Chipset, 17.5Mm; Thickness Wakefield Thermal - 62AC1396 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Phase Change Pad, Chipset, 17.5Mm; Thickness Wakefield Thermal
62AC1396
Phase Change Pad, Chipset, 17.5Mm; Thickness Wakefield Thermal 62AC1396
PHASE CHANGE PAD, CHIPSET, 17.5MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:17.5mm; External Width:17.5mm; Product Range:ulTIMiFlux Series RoHS Compliant: Yes

PHASE CHANGE PAD, CHIPSET, 17.5MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:17.5mm; External Width:17.5mm; Product Range:ulTIMiFlux Series RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 62AC1396
Product Name Phase Change Pad, Chipset, 17.5Mm; Thickness Wakefield Thermal
Unlock Full Specs
to access all available technical data

Similar Products

Two-Part Thermal Gap Filler - SARCON® LG23A and LG30A - Fujipoly® America Corp.
Fujipoly® America Corp.
Two-Part Thermal Gap Filler
SARCON® LG23A and LG30A
Specs
Type High Dielectric
Cure / Technology Two Component  ; Room Temperature Vulcanizing or Curing
Form / Shape Gel; Gap Filler, Foam in Place Gasket
View Details
Potting Compound Solutions for PCBAs - Electrolube ® ER2218 Low Viscosity Retardant Epoxy Resin - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Potting Compound Solutions for PCBAs
Electrolube ® ER2218 Low Viscosity Retardant Epoxy Resin
Specs
Cure / Technology Two Component  
Chemical System Epoxy
Industry Electronics; Semiconductors, IC's
View Details
High thermal conductivity adhesive silicone thermal pads - SF600G - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
High thermal conductivity adhesive silicone thermal pads
SF600G
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details