Wakefield Thermal, Inc. Phase Change Pad, To-3, 39.4 X 26.7Mm; Thickness Wakefield Thermal CD-02-05-3-8

Description
PHASE CHANGE PAD, TO-3, 39.4 X 26.7MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:39.4mm; External Width:26.7mm RoHS Compliant: Yes
Datasheet
Description
PHASE CHANGE PAD, TO-3, 39.4 X 26.7MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:39.4mm; External Width:26.7mm RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Phase Change Pad, To-3, 39.4 X 26.7Mm; Thickness Wakefield Thermal - 62AC1423 - Newark, An Avnet Company
Chicago, IL, United States
Phase Change Pad, To-3, 39.4 X 26.7Mm; Thickness Wakefield Thermal
62AC1423
Phase Change Pad, To-3, 39.4 X 26.7Mm; Thickness Wakefield Thermal 62AC1423
PHASE CHANGE PAD, TO-3, 39.4 X 26.7MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:39.4mm; External Width:26.7mm RoHS Compliant: Yes

PHASE CHANGE PAD, TO-3, 39.4 X 26.7MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:39.4mm; External Width:26.7mm RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 62AC1423
Product Name Phase Change Pad, To-3, 39.4 X 26.7Mm; Thickness Wakefield Thermal
Unlock Full Specs
to access all available technical data

Similar Products

High quality thermally conductive thermal gel putty - SE30 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details
Thermally Conductive, Electrically Non-Conductive Silicone Meets NASA Low Outgassing Specifications - MasterSil 323AO-LO - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Form / Shape Gap Filler, Foam in Place Gasket
View Details
Carbon Fiber Thermal Gap Fillers - CF210A - Fujipoly® America Corp.
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Use Temperature -40 to 302 F (-40 to 150 C)
View Details