Board Level Power Semiconductor Heat Sinks. Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers' component thermal specifications. Features and Benefits: • No interface material is needed. • Copper and matte tin plating for improved solderability and assembly. • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ""Tape and Reel"" and ""Tube"" formats. • EIA standards and ESD protection are specified. • Can be used with water soluble or no clean SMT solder creams or other pastes.
HEAT SINK, 3.3°C/W, ALUMINIUM, TO-202/TO-220; Thermal Resistance:3.3°C/W; Packages Cooled:TO-202, TO-220; External Width - Metric:35.1mm; External Height - Metric:50.8mm; External Length - Metric:12.7mm; External Diameter - Metric:- RoHS Compliant: Yes
| Richardson RFPD | Newark, An Avnet Company | |
|---|---|---|
| Product Category | Heat Sinks | Heat Sinks |
| Product Number | 232-200ABE-23 | 78R1824 |
| Product Name | Board Level Heat Sink | Heat Sink, 3.3°C/w, Aluminium, To-202/to-220; Thermal Resistance Wakefield Thermal |
| H | 50.8 mm (2 inch) | 50.8 mm (2 inch) |
