Wakefield Thermal, Inc. Thermal Insulator; Insulator Body Material Wakefield Thermal 175-6-280P

Description
THERMAL INSULATOR; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:-; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; Length:21.84mm RoHS Compliant: Yes
Datasheet
Description
THERMAL INSULATOR; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:-; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; Length:21.84mm RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Insulator; Insulator Body Material Wakefield Thermal - 84F729 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Insulator; Insulator Body Material Wakefield Thermal
84F729
Thermal Insulator; Insulator Body Material Wakefield Thermal 84F729
THERMAL INSULATOR; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:-; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; Length:21.84mm RoHS Compliant: Yes

THERMAL INSULATOR; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:-; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; Length:21.84mm RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 84F729
Product Name Thermal Insulator; Insulator Body Material Wakefield Thermal
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Heat Transfer Compound - NH Nonhardening - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Liquid; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 410 F (0 to 210 C)
View Details
Formulations - Applications - Thermally Conductive - Dissipator 745 - 745PT - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Two Component Nickel Conductive Epoxy Adhesive - EP21TDCNFL - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Optional Premixed and Frozen; Grease, Paste; Gap Filler, Foam in Place Gasket
View Details