Wakefield Thermal, Inc. Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal 103

Description
SEMICONDUCTOR HARDWARE, INSULATORS; Insulator Body Material:PTFE (Polytetrafluoroethy lene); Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:5.5mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes
  • Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal - 58F518 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
SEMICONDUCTOR HARDWARE, INSULATORS; Insulator Body Material:PTFE (Polytetrafluoroethy lene); Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:5.5mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal - 58F518 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal
58F518
Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal 58F518
SEMICONDUCTOR HARDWARE, INSULATORS; Insulator Body Material:PTFE (Polytetrafluoroethy lene); Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:5.5mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes

SEMICONDUCTOR HARDWARE, INSULATORS; Insulator Body Material:PTFE (Polytetrafluoroethylene); Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:5.5mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 58F518
Product Name Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal
Unlock Full Specs
to access all available technical data

Similar Products

Non-silicone thermal pad from the manufacturer suitable for smartphones - AF300 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Non-silicone thermal pad from the manufacturer suitable for smartphones
AF300
Specs
Form / Shape Pad
Chemical System Silicone
Industry Electronics
View Details
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D - 746D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D
746D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Chemical System Silicone
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions - EP93FRHT - Master Bond, Inc.
Master Bond, Inc.
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions
EP93FRHT
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Form / Shape Liquid; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
View Details
Thermal Pads - 2457302 - RS Components, Ltd.
RS Components, Ltd.
Thermal Pads
2457302
Specs
Thermal Conductivity 1600 W/m-K (924 BTU-ft/hr-ft²-F)
View Details